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M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 R-5775G PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 R-5775G PCB

Country/Region china
City & Province shenzhen guangdong
Categories Motherboards
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Product Details

Megtron 6 (M6) R-5775G PCB High Speed Low Loss Multilayer Printed Circuit Board

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Dear PCB friends,

Today, I am going to talk about a type of high speed low loss multilayer PCB: M6 R-5775 PCB.

 

Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.

 

Part Numbers

Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)

Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670

 

Main Features

Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)

Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)

Lead-free, ROHS-compliant soldering

High heat resistance

M6 also provides excellent high-density interconnect (HDI) and thermal performance.

 

 

Our PCB Capabilities (Megtron 6)

PCB Material:Low DK Glass Cloth
Designation:Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant:3.61 at 10GHz
Dissipation Factor0.004 at 10GHz
Layer count:Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Main Applications

Antenna (Automotive millimeter wave radar, Base station)

ICT infrastructure equipment,

Measuring instrument,

Super computer,

 

Typical Value of R-5775

PropertyUnitsTest MethodConditionTypical Value
THERMALGlass Transition Temp ( Tg )CDSCAs received185
 DMAAs received210
Thermal Decomposition TempCTGAAs received410
Time to Delam (T288)Without CuMinIPC TM-650 2.4.24.1As received> 120
With CuMinIPC TM-650 2.4.24.1As received> 120
CTE : α1X - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg14 - 16
Y - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg14 - 16
Z - axis ppm / Cppm / CIPC TM-650 2.4.24< Tg45
CTE : α2Z - axis ppm / Cppm / CIPC TM-650 2.4.24> Tg 260260
ELECTRICALVolume ResistivityMΩ - cmIPC TM-650 2.5.17.1C-96/35/901 x 109
Surface ResistivityMΩIPC TM-650 2.5.17.1C-96/35/901 x 108
Dielectric Constant ( Dk )@ 1GHz/IPC TM-650 2.5.5.9C-24/23/503.71
@ 10GHz/IPC TM-650 2.5.5.5C-24/23/503.61
Dissipation Factor ( Df )@ 1GHz/IPC TM-650 2.5.5.9C-24/23/500.002
@ 10GHz/IPC TM-650 2.5.5.5C-24/23/500.004
PHYSICALWater Absorption%IPC TM-650 2.6.2.1D-24/230.14
Peel Strength1oz ( H-VLP )kN / mIPC TM-650 2.4.8As Received 0.80.8
Flammability/ULC-48/23/5094V-0

 

Megtron 6 Material List in stock (as of September 2021)

ItemThickness (mil)Thickness(mm)StructureCopper weight(oz)Type of copper
R5775G2.00.0501035*1H/HHVLP
R5775G2.60.0651080*1H/HHVLP
R5775G3.00.0751078*11.0/1.0RTF
R5775G3.00.0751078*1H/HRTF
R5775G3.00.0751078*11.0/1.0HVLP
R5775G3.00.0751078*1H/HHVLP
R5775G3.90.1003313*1H/HRTF
R5775G3.90.1003313*11.0/1.0RTF
R5775G5.90.1501080*22.0/2.0RTF
R5775G9.80.2502116*2H/HRTF

 

 

We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.

 

Thanks for your reading.

 
 
 
 

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