Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Rogers 4003 32mil 0.813mm PCB RO4003C Double Sided RF High Frequency PCB for Filters
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials. The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.
PCB Specifications
| PCB SIZE | 98 x 72mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
| RO4003C 32 mil 0.813mm | |
| copper ------- 35um(1oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6.98mil/6.28mil |
| Minimum / Maximum Holes: | 0.3/1.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 481 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4003C 32 mil (0.813mm), Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.9 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | N/A |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data Sheet of Rogers 4003C (RO4003C)
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
