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4 Layer RF Circuit Board On Rogers 60mil RO4350B and 10mil RO4350B with Back Drill for UHF Coupler

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

4 Layer RF Circuit Board On Rogers 60mil RO4350B and 10mil RO4350B with Back Drill for UHF Coupler

Country/Region china
City & Province shenzhen guangdong
Categories Other Wires, Cables & Cable Assemblies
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Product Details

4 Layer RF Circuit Board On Rogers 60mil RO4350B and 10mil RO4350B with Back Drill for UHF Coupler

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

This 4 layer RF PCB is built on 60mil RO4350B and 10mil RO4350B for the application of UHF coupler. Look at the stack-up.

 

 

Base materials are 60mil RO4350B core and 10mil RO4350B core plus 4mil RO4450F prepreg. There’re 35 μm(1oz) copper on each layer with final height 2.1mm thick. Pads are immersion gold plated. There’re back drilled via from 10mil core. Back drilling can reduce noise interference and improve signal integrity. Using back drilling successfully reduced the difficulty of PCB fabrication and avoided the use of buried /blind via.

 

Features and benefits

1) RO4350B exhibits a stable dielectric constant over a broad frequency range;

2) RO4350B makes it an ideal substrate for broadband applications;

3) Delivery on time higher than 98% on-time-delivery rate;

4) Focusing on small batches and medium volume production;

5) Strict WIP inspection and monitoring as well as working instruction;

 

Applications

Antenna, Interference filter, Sound control switch induction, Trunk amplifier

 

PCB Data Sheet

PCB SIZE91 x 98mm=1PCS
BOARD TYPEHigh Frequency PCB
Number of LayersMultilayer PCB, 4 Layer PCB
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um(1oz)+plate TOP layer
RO4350B 60 mil
copper ------- MidLayer 1
RO4450F 4 mil
copper ------- MidLayer 2
RO4350B 10 mil
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:10mil / 10mil
Minimum / Maximum Holes:0.3/3.21mm
Number of Different Holes:5
Number of Drill Holes:1680
Number of Milled Slots:1
Number of Internal Cutouts:1
Impedance Controlno
BOARD MATERIAL 
Glass Epoxy:Rogers RO4350B( core 10mil, DK=3.48) & RO4450B(PP 4mil DK=3.54)
Final foil external:1.5oz
Final foil internal:1oz
Final height of PCB:2.1mm ±10%
PLATING AND COATING 
Surface FinishImmersion Gold (71.1%) 2µ" over 100µ" nickel
Solder Mask Apply To:Top and Bottom layer
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated Through Hole(PTH), via open
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.
 
 

 

 

 

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