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Rogers 3003 PCB RO3003 High Frequency PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Silver and Tin

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers 3003 PCB RO3003 High Frequency PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Silver and Tin

Country/Region china
City & Province shenzhen guangdong
Categories Rubber Product Making Machinery Parts
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Product Details

Rogers 3003 PCB RO3003 High Frequency PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Silver and Tin

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today we’re talk about RO3003 high frequency PCBs.

 

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.

 

Let’s see some more features and applications.

 

 

1. low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.

2. Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

3. excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

4. Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

5. low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

Our PCB Capability (RO3003)

PCB Material:Ceramic-filled PTFE composite
Designator:RO3003
Dielectric constant:3.0 ±0.04 (process)
3.0 (design)
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil (0.508mm)
30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  

 

RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

 

Typical Applications

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

 

 

The basic colour of RO3003 PCB is white.

 

The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

 

Should you have any questions, please feel free to contact us.

 

Thank you for your reading.

 

Appendix: Data Sheet of RO3003

 

RO3003 Typical Value
PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z 10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z 10 GHz/23IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
Dimensional Stability0.06
0.07
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107 COND AIPC 2.5.17.1
Tensile Modulus930
823
X
Y
MPa23ASTM D 638
Moisture Absorption0.04 %D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9 j/g/k Calculated
Thermal Conductivity0.5 W/M/K50ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/23/50% RHIPC-TM-650 2.4.4.1
Td500  TGA ASTM D 3850
Density2.1 gm/cm323ASTM D 792
Copper Peel Stength12.7 Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    
 
 
 
 

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