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High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

Country/Region china
City & Province shenzhen guangdong
Categories Other Wires, Cables & Cable Assemblies
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Product Details

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we’re going to talk about 4-layer high frequency PCB made on 12mil RO4003C and FR-4 combined.

 

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

 

Let’s see today’s first board.

 

 

Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the rest are FR-4 materials. Copper weight on inner layer and outer layer is 1 ounce.

 

The 2nd board FR-4 is moved to layer 3 and layer 4. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.

 

 

The applications of 12mil RO4003C hybrid PCB is wide, such as Modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

 

The advantages of 12mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

 

Our PCB Capability (Hybrid Design)

PCB Type:Hybrid PCB, Mixed PCB
Mixed type:RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
Duroid/RT5880 + RO4350B
Duroid/RT5880 + FR4
Solder mask:Green, Red, Blue, Black, Yellow
Layer count:4 Layer, 6 Layer, Multilayer
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:1.0-5.0mm
PCB size:400mm X 500mm
Surface finish:Bare copper, HASL, ENIG, Immersion tin, OSP

 

At the same time, we are able to supply blind via board, buried via board and HDI board. All the PCB's of our company will go through AOI test, open and short circuit test, solderability test and 288 ℃ thermal stress test to ensure high quality PCB shipped to your hands.

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 
 
Appendix: Data Sheet of RO4003C
RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280 ℃ TMAAIPC-TM-650 2.4.24.3
Td425 ℃ TGA ASTM D 3850
Thermal Conductivity0.71 W/M/oK80℃ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.79 gm/cm323℃ASTM D 792
Copper Peel Stength1.05
(6.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/A   UL 94
Lead-free Process CompatibleYes    

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