A623308M-70SF Integrated Circuit Chip 8K X 8 BIT CMOS SRAM memory IC

A623308 Series 

8K X 8 BIT CMOS SRAM

Features

• External Operating Voltage: 4.5V to 5.5V

• Access times: 70 ns (max.)

• Current:

  A623308-S series:           Operating: 35mA (max.)

                                          Standby: 10mA (max.)

  A623308-SI/SU series:    Operating: 35mA (max.)

                                          Standby: 15mA (max.)

General Description

The A623308 is a low operating current 65,536-bit static random access memory organized as 8,192 words by 8 bits and operates on a single 5V power supply. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures.

• Extended operating temperature range: 0°C to 70°C for -S series, -25°C to 85°C for -SI series, -40°C to 85°C for -SU series.

• Full static operation, no clock or refreshing required

• All inputs and outputs are directly TTL compatible

• Common I/O using three-state output

• Data retention voltage: 2.0V (min.)

• Available in 28-pin SOP and TSOP (forward type) packages

Minimum standby power is drawn by this device when CE is at a high level, independent of the other input levels. Data retention is guaranteed at a power supply voltage as low as 2.0V.

Pin Configurations

Block Diagram

Absolute Maximum Ratings*

V_CC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V

IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to V_CC + 0.5V

Operating Temperature,

  Topr . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C or -40°C to +85°C

Storage Temperature, Tstg . . . . . . . . . -55°C to +125°C

Power Dissipation, P_T . . . . . . . . . . . . . . . . . . . . . 0.7W

Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec

*Comments

Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied and exposure to absolute maximum rating conditions for extended periods may affect device reliability.

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