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Aluminum Bottom Heatsink With Heatpipe Practical Plating Nickel

Dongguan Fodor Technology Co., Ltd

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Aluminum Bottom Heatsink With Heatpipe Practical Plating Nickel

Country/Region china
City & Province dongguan guangdong
Categories Other Lighting Accessories
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Product Details

Aluminum Bottom Plate 4 Pcs Heat Pipes Heat Pipe Radiator With Plating Nickel

 

Quick Detail

 

Raw MaterialAL5052 and 4 heat pipe
Custom ServiceYes, OEM/ODM Service
Quality SystemISO9001:2015
Processing TechnologyCutting/Wood machining/CNC/Riveting
Surface treatmentplating nickel
Packing WayBlister packaging or special packing you would like
Application ScenarioElectronic equipment heat sink
MOQ Request100/500/1000

 

 

Description

    Heat pipe radiator is a new product produced by using heat pipe technology to make major improvements to many old radiators or heat exchange products and systems. There are two types of heat pipe radiators: natural cooling and forced air cooling. The thermal resistance of air-cooled heat pipe radiator can be made smaller, and it is often used in high-power power supplies. 

 

 

Note

The heat pipe radiator is composed of a sealed tube, a liquid wick and a steam channel. The wick surrounds the tube wall of the sealed tube and is immersed in a saturated liquid that can volatilize. This liquid can be distilled water or ammonia, methanol or acetone. The heat pipe radiator filled with ammonia, methanol, acetone and other liquids still has a good heat dissipation capacity at low temperatures.

 

When the heat pipe radiator is running, its evaporation section absorbs the heat generated by the heat source (power semiconductor devices, etc.), so that the liquid in the wick will boil into steam. The steam with heat moves from the evaporation section of the heat pipe radiator to its cooling section. When the steam transfers heat to the cooling section, the steam condenses into liquid. The condensed liquid returns to the evaporation section through the capillary action of the wick on the tube wall, and repeats the above-mentioned circulation process to continuously dissipate heat.

 

The heat pipe radiator is a high-efficiency radiator device with unique heat dissipation characteristics. That is, it has high thermal conductivity, and the temperature distribution along the axial direction between the evaporation section and the cooling section is uniform and substantially equal.
The thermal resistance of the heat sink is determined by the thermal conductivity of the material and the effective area in the volume. When the volume of a solid aluminum or copper radiator reaches 0.006m³, increasing its volume and area will not significantly reduce the thermal resistance. For discrete semiconductor devices that dissipate heat on both sides, the thermal resistance of an air-cooled all-copper or all-aluminum heat sink can only reach 0.04°C/W. The heat pipe radiator can reach 0.01℃/W. Under the condition of natural convection cooling, the performance of the heat pipe radiator can be improved by more than ten times than that of the physical radiator.

 

The heat pipe radiator has the following advantages:

  • The thermal response speed is fast, and its ability to transfer heat is more than 1000 times larger than that of copper pipes of the same size and weight;
  • Small size and light weight;
  • High heat dissipation efficiency, which can simplify the heat dissipation design of electronic equipment, such as changing air-cooling to self-cooling;
  • No external power supply is required, and no special maintenance is required during work;
  • It has good isothermal properties. After heat balance, the temperature gradient between the evaporation section and the cooling section is quite small, which can be approximately regarded as 0;
  • The operation is safe and reliable, and does not pollute the environment.

 

We can offer the heat pipe radiator service, small qty is acceptable.

 

Technical Support

We can offer the design and simulation service. For example, our German customer's case.

According to the simulation results,the simulated chip is in compliance with the temperature requirements specficied by customer.

 

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