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95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

Yixing Minghao Special Ceramic Technology Co., Ltd.

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Address: Dashu Industry Park, Nanyuan Village, Yichen Subdistrict, Yixing City, 214225, Jiangsu Province, China

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95% Copper Coated DBC Direct Bonded Copper Substrate Ceramic Substrate With Gold-Plated

Country/Region china
City & Province jiangsu
Categories Welding Tips
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Product Details

 

Copper coated DBC ceramics substrate with Gold-plated

 

Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.
 
1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation

 

PropertiesUnitSteatite ceramic95% Al2O399% Al2O3Zirconia Ceramic
Densityg/cm³2.83.63.85.6
Flexural strengthMpa145300300354
Max Working Temperature1100140016001400
Sintering temperature1350170017501550
Heat resistanceT(℃)200220200350
HardnessGpa5.7710.712.3
Elastic modulusGpa120275320205
Poissons ratio-0.210.220.220.30
Linear expansion coefficientx 10-6/℃7.97.17.89
Insulation breakdown IntensityKT/mm10161815
Thermal conductivityw/(m.k)2.520252.5
Specific Heat*10-3J/(kg*K)0.750.780.780.4

 

 

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