Results for1gb pc2700 ddr sdram sodimmfrom 709 Products.
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MT46V32M16CV-5B IT:J Specifications Part Status Active Memory Format RAM Memory Type DDR SDRAM Memory Size 512M (32M x 16) Speed 200MHz Interface Parallel Voltage - Supply 2.5 V ~ ...
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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M25P10-AVMN6TP Chipscomponent Electronic Components IC Chips 1Mb SPI 50 MHz 8 ns 8- so Category Integrated Circuits (ICs) Mfr Analog Devices Inc. Series M25P10-AVMN6TP Reference ...
china
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Product Details MCF5208 ColdFire® Microprocessor Data Sheet Supports MCF5207 & MCF5208 The MCF5207 and MCF5208 devices are highly-integrated, 32-bit microprocessors based on the ...
china
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20-Port Copper/SFP Uplink 300W Gigabit Managed PoE Switch 16 Port Gigabit Managed PoE Switch Commercial Rack Type 300W With 4 Uplink Ports Specification of PoE managed switch Input...
china
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32inch Free Standing Touch Screen Kiosk Information Vertical Display With Camera Card Reader Product Parameter Android CPU RK3568Cortex-A9 4-core, up to 1.5GHz DDR DDR-III 1GB(2GB...
china
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Android 3G 4G WIFI Touchable Handheld POS Terminal With Customized Colors ★ Android 7.0 OS and Quad-Core The performance of WCT-S8 is higher than the general level on the market ...
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Description • Each acquisition card is configured with 1GB high-capacity DDR memory to ensure that data is not lost during instantaneous transmission of a large number of signals ...
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we also have many other items IC in stock , pls kindly check it: SDRAM- PC100 SD 8Mx16-10 FBGA lead free EDS1216GABH-10-E Elpida 20000 booking SD 2Mx8-8 PC125 CL3 TSOP HY57V168010DTC-8 Hynix 3000 3 days SD 8Mx32-PC100 ...
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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Product Details GENERAL DESCRIPTION W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. ...
china
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Network module card of saeu3h nondestructive acoustic emission test system NDT Testing Characteristic • Each acquisition card is configured with 1GB high-capacity DDR memory to ...
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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Specifications Attribute Attribute Value Manufacturer Alliance Memory, Inc. Product Category Memory ICs Series - Packaging Tray Alternate Packaging Package-Case 66-TSSOP (0.400", ...
china
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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Product Details GENERAL DESCRIPTION W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. ...
china
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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Product Details GENERAL DESCRIPTION W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. ...
china
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage ...
china
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