Results forwaved fins heat sinkfrom 19608 Products.
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Low Thermal Resistance High Dielectric Constant Materials For CPU Heat Sinking The TIF100-16-38UF thermally conductive interface materials are applied to fill the air gaps between ...
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Aluminum Alloy Welded Heat Sink Factory Direct Sales High-Quality Description: A heatsink is used to dissipate heat generated by electronic components. It is made of materials like ...
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304 Stainless Steel Boiler Fin Tube H Type Fins Heat Exchange Replacement Part Product Description Double H finned tube structure is easy to knot of pipe grey parts adopted a ...
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ISO9001 Antirust Cold Forging Heat Sink , Anti Oxidation Pin Fin Heatsinks Product Parameters Part No. HYTHD090060 Dimensions ∮90*60mm Net weight 235g Surface area 776CM² Surface ...
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Product Description: Copper Pipe Heat Sink is a reliable and effective heat dissipation solution with a broad range of application in the industry. This heat sink features a high...
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Heat Sink Thermal Conductive Adhesive Tape , 0.8 W / mK Glass Fiber Backing Heat Resistant Tape The TIA™815 Series products are mostly used for bonding heat dissipation fins, ...
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Heat conductive epoxy bonded fin heat sink 203(W)*114(H)*228(L)mm #detail_decorate_root .magic-0{border-bottom-width:2px;border-bottom-style:solid;border-bottom-color:#53647a...
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Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF™100-10E thermally conductive interface materials are applied to ...
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Good quality best price UL high conductivity thermal conductive pad 2W 2.75 g/cc for devices and heat sink The TIF140-20-12E thermally conductive interface materials are applied to ...
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Cooling thermal conductive pad heat sink silicone soft gap pad 1.5 W/mK TIF180-25E The TIF180-25E Series thermally conductive interface materials are applied to fill the air gaps ...
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2.8W thermal conductivity thermal gap filler pad for LED light heat sinking The TIF310FG thermally conductive interface materials are applied to fill the air gaps between the ...
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blue Silicone High Insulating Heat Sink Thermal Gap Pad TIF540S with Adhesive Coating 3.2 W/mK The TIF540S Series thermally conductive interface materials are applied to fill the ...
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blue Silicone High Insulating Heat Sink Thermal Gap Pad TIF520S with Adhesive Coating 3.2 W/mK The TIF520S Series thermally conductive interface materials are applied to fill the ...
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2mm Thickness Thermal Gap Pad Ziitek TIF™580US For Heat Sinking Housing At LED-lit BLU in LCD 18 Shore 00 2.95 g/cc The TIF™580US Series thermally conductive interface materials ...
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Special designed 4.0mm 94 V0 Silicon heat sink pad For CD-Rom, DVD-Rom cooling 2.6w The TIF™5160US Series thermally conductive interface materials are applied to fill the air gaps ...
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Die Cut Thermal Conductive Silicone Gap Filler Pad 12±5 shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF120-05ES thermally conductive interface materials are applied ...
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LED Heat Sink High Adhesive Tape , Thermal Adhesive Aluminum Foil Tape RoHs The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and ...
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LED Heat Sink Aluminum Foil Adhesive Tape with High Thermal Conductivity 1.6 W /mK The TIA™800AL Series products are mostly used for bonding heat dissipation fins, microprocessors ...
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Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, ...
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Heat Sink Thermal Conductive Acrylic Based Adhesive High Bond Strength 10" x 18" Size The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocesso...
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