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Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Suzhou Direction Chemical Co.,Ltd

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Contact name:Christopher Cao

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Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Country/Region china
City & Province jiangsu
Categories Adhesives & Sealants
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Product Details

Polyamide Hot-melt Adhesive/Hemming Adhesive (DY-P404)

 

1.Appearance:

      Yellowish round grain with schistose shape

 

2.Property:

DY-P404 is a general type of polyamide hot-melt adhesive, which is made from dimer acid and polyamine through condensation reaction at high temperature.

It can dissolve in general organic solvents, the hot-melting viscosity of the resin is greatly related to the temperature that it gets.

The polyamide hot-melt adhesive possesses the following advantages, such as lower viscosity, good fluidity, good flexibility, high adhesive strength, good media corrosion resistance, good solubility and fluxing property at low temperature, higher heat stability etc.

 

3.Application

This type of resin is applied in heat-shrinkable sleeve for electric cable, sealing material for electrical connection, cementing or fixing materials for electronic component, bonding material for package, textile, leather, wood, plastic, metal and ceramics etc.

 

4.Technologic Index

Acid Value,(mg KOH/g ≤)5
Amine Value,(mg KOH/g≤)3
Viscosity,(mpa.s/200ºC)10000-20000
Softening Point,(ºC)120±5
Color,(Fe-Co ≤)8
Tensile Strength, (≥ MPa)20
Water absorption, (≤ %)0.4
Shear Strength, (≥ MPa, AL/AL)11
Stretch Rate, (≥ %)800

Peeling strength,

(≥ N/25mm,PE/PE,60±2ºC)

100
Operating Temperature( ºC )160-200
 
 
5.Packaging & Storage

Double packing: PP textile bag lined with PE film or paper-plastic composite bag lined with PE film.

Net weight is 25Kgs per bag.

Store in cool, airy and dry place, the package has to be sealed before using up the resins.

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