Home Companies Unicomp Technology

Electronic Boards 2D & 2.5D X-ray Machine AX9100MAX With 360 Degrees Rotation Table For BGA&PCB

Unicomp Technology

Contact Us

[China] country

Trade Verify

Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen

Contact name:James Lee

Inquir Now

Unicomp Technology

Verified Suppliers
  • Trust
    Seal
  • Verified
    Supplier
  • Credit
    Check
  • Capability
    Assessment

Electronic Boards 2D & 2.5D X-ray Machine AX9100MAX With 360 Degrees Rotation Table For BGA&PCB

Country/Region china
City & Province shenzhen guangdong
Categories EL Products
InquireNow

Product Details

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

 

 

  • Application Fields

     

 

 

 

  • Functions and Feature

     

 

 

 

 

 

 

  • Inspection Image

     

     

 

 

 

System Summary
Footprint1450(W)×1680(D)×1850(H)mm
Machine Weight2400 kg
Power Supply220AC/50Hz
Packaging Dimension1710(W)×1950(D)×1875(H)mm
Power Consumption3.5 kW
Packing Weight2600 kg
X-Ray Tube
Tube Type TypeSealed type
Max. Power Output65W
Voltage0~130kV (Adjustable)
Focus Spot Size≤8μm
Imaging System
DetectorHigh Resolution FPD
Pixel Size≤85μm
Effective Detection Area130*130mm
Pixel1536*1536
System Magnification1600X
Frame Rates20fps
Software
One-click Zoom in & outFast & Automatic navigation of ROI region
Fixed-point following during FPD tiltingTable automatic following while Axis tilting seperately
Algorithms For Image Super-Resolution ReconstructionIntelligently improve the overall image clarity with one-click
Variety of filter processing algorithmsSharpening, enhancement, color reversal, denoising image preprocessing functions
Automatic images comparisonIntelligently adjust overall image contrast with one-click
Motion Control System
Movement Control MethodDual Joystick, Keypad & Mouse
Max. Loading sizeФ620mm
Max. Inspection size600*450mm
Tilting InspectionMaximum 60°
Objective StageHorizontal Rotation 360°
Industrial PC
Operating SystemWindows 10 64bit
Monitor(Dual)27 "4K HD display
Hard disk1TB
RAM16G
CPU modelIntel i7 Processor
Other Features
Door OpenManually
Safety OperationElectromagnetic Interlock, Warning Light and Real-time Radiation Leakage Monitor
Authority ManagementFingerprint Access Management System, and Support Password Accessing
X-Ray Safety<1μSv/h (Meets All International Standards)

* Specifications are subject to change without notice, All trademarks are the property of the system maker.

 

 

 

 

  • Dimensions and Appearance

 

 

 

Hot Products

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, ...
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, ...
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, ...
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, ...
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, ...
NDT UNS160 X Ray Equipment Applications of NDT X-ray Machine UNS 160-A : various types of metal ...