Results fortif1100 30 11esfrom 20 Products.
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good performance thermal gap filler TIF1100-30-11ES,3.0 W/m-K for Memory Modules The TIF1100-30-11ES use a special process, with silicone as the base material, adding thermal ...
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China company supplied gray silicone rubber pads TIF1100-30-11ES,for Audio and video components Company Profile With professional R&D capabilities and over 13 year experiences in ...
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New type manufatured ultra soft 3.0W/MK Thermal Conductive Silicone Pad 0.5mmT good performance For routers Company Profile Ziitek Electronic Material and Technology Ltd. provides ...
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insulation and ultra soft thermal conductive gap pad 1.0mmT, 12 Shore 00 for RDRAM memory modules The TIF140-30-11ES is a highly compliant Gap Pad material that is ideal for ...
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Electrically isolating new developed silicone thermal pad for Audio and video components,2.9 g/cc,1.5mmT The TIF160-30-11ES is recommended for applications that require a minimum ...
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factory supply 2.9g/cc,2.0mmT heat sink pad for Set top boxes ,with fiberglass reinforced for puncture The TIF180-30-11ES is recommended for applications that require a minimum ...
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3.0mmT,Continuos Use Temp: -40 to 160℃,an electrically isolating silicone pads for IT infrastructure The TIF1120-30-11ES is a highly compliant Gap Pad material that is ideal for ...
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Electrically isolating thermal gap pad for CD-Rom, DVD-Rom cooling,12 Shore 00,Dielectric Breakdown Voltage: >5500 VAC Company Profile Ziitek thermal conductive interface materials ...
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The gray ultra soft heat sink pad for LED Ceilinglamp,Electrically isolating:dielectric Breakdown Voltage over 5500 The TIF1140-30-11ES is recommended for applications that require ...
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1.5 W/mK New developed thermally conductive silicone rubber, 2.9 g/cc,12 Shore 00,for Micro heat pipe thermal solutions Company Profile Ziitek Electronic Material and Technology ...
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UL recognized popular thermal gap filler for Handheld portable electronics,3.0 W/m-K,2.9 g/cc The TIF1160-30-11ES use a special process, with silicone as the base material, adding ...
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good performance insulation silicone pads for RDRAM memory modules ,12 Shore 00,3.0 W/m-K The TIF1180-30-11ES is recommended for applications that require a minimum amount of ...
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4.5mmT thermal pad for CD-Rom, DVD-Rom cooling,3.0W/mK, 2.9 g/cc Company Profile Ziitek thermal conductive interface materials are widely recognized and trusted by users and can ...
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High cost-effective thermal pad, 94 V0, 12 Shore 00 for Automotive electronics The TIF1200-30-11ES is a silicone based, thermally conductive gap pad. Its unreinforced construction ...
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2.5mmt Low Cost and High Durability Thermal Pad for Power Supply The TIF1100-30-06UF is recommended for applications that require a minimum amount of pressure on components. The ...
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new type Moldability for complex parts UL recognized 3.0 W/mK thermal conductive pad for notebook,2.5mmT The TIF1100-30-06US use a special process, with silicone as the base ...
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2.5mmT Easy Release Construction Thermal Gap Pad For SMD LED module,-40 to 160℃ The TIF1100-30-02US is a silicone based, thermally conductive gap pad. Its unreinforced construction ...
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3.0 W/m-K high cost-effective heat sink pad 12 Shore 00 for Micro heat pipe thermal solutions The TIF120-30-11ES is not only designed to take advantage of the gap heat transfer, to ...
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94 V0 low cost and good performance thermal gap pad for Micro heat pipe thermal solutions,-40 to 160℃ The TIF1100-30-11US is an extremely soft gap filling material rated at a ...
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2.5mmT Easy release construction silicone pads for notebook,0.35% TML The TIF1100-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete ...
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