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Notebook / Desktop Low Melting Point Thermal Interface Material , 0.127 - 0.25mm Thickness

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Notebook / Desktop Low Melting Point Thermal Interface Material , 0.127 - 0.25mm Thickness

Country/Region china
City & Province dongguan guangdong
Categories Paper Bags
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Product Details

Notebook and Desktop PCs Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness Replace LairdT-PCM905C

 

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

  

  The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

 

     The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 


Features:


>  0.024℃-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required 


Applications:


>  High Frequency Microprocessors
>  Notebook and Desktop PCs
>  Computer Serves
>  Memory Modules
>  Cache Chips
>  IGBTs

>  Telecommunication 

 

Typical Properties of TIC™800Y Series
Product Name
TICTM803Y
TICTM805Y
TICTM808Y
TICTM810Y
Testing standards
Color
Yellow
Yellow
Yellow
Yellow
Visual
Composite Thickness

 

0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.2g/cc
  Helium  Pycnometer
Work temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.021℃-in²/W
0.024℃-in²/W
0.053℃-in²/W
0.080℃-in²/W
ASTM D5470 (modified)
0.14℃-cm²/W
0.15℃-cm²/W
0.34℃-cm²/W
0.52℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.
 
 

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract

 

 

Ziitek Culture

Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

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