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Solid Power-DS-SPS200B17G6R8-S04020023 V1.0
1700V 200A IGBT Half Bridge Module
Features:
□ 1700V Trench+ Field Stop technology
□ Freewheeling diodes with fast and soft reverse recovery
□ VCE(sat) with positive temperature coefficient
□ Low switching losses
Typical Applications:
□ Motor/Servo Drives
□ High Power Converters
□ UPS
□ Photovoltaic
Package
Item | Symbol | Conditions | Values | Unit | |||
Isolation test voltage | VISOL | RMS, f = 50 Hz, t =1 min | 4.0 |
kV | |||
Material of module baseplate | Cu | ||||||
Internal isolation | (class 1, IEC 61140) Basic insulation (class 1, IEC 61140) | Al2O3 | |||||
Creepage distance | dCreep | terminal to heatsink | 29.0 |
mm | |||
dCreep | terminal to terminal | 23.0 | |||||
Clearance | dClear | terminal to heatsink | 23.0 |
mm | |||
dClear | terminal to terminal | 11.0 | |||||
Comparative tracking index | CTI | >400 | |||||
Item | Symbol | Conditions | Values | Unit | |||
Min. | Typ. | Max. | |||||
Stray inductance module | LsCE |
20 |
nH | ||||
Module lead resistance, terminals - chip | RCC’+EE’ | TC=25℃ |
0.70 |
mΩ | |||
Storage temperature | Tstg |
-40 |
125 | ℃ | |||
Mounting torque for module mounting | M6 |
3.0 |
6.0 |
Nm | |||
Terminal connection torque | M6 |
2.5 |
5.0 |
Nm | |||
Weight | G |
320 |
g |
IGBT
Item | Symbol | Conditions | Values | Unit | |
Collector-emitter Voltage | VCES | Tvj=25℃ | 1700 |
V | |
Maximum gate-emitter voltage | VGES | ±20 |
V | ||
Transient gate-emitter voltage | VGES | tp≤10μs,D=0.01 | ±30 |
V | |
Continuous DC collector current | IC | TC=25℃ | 360 |
A | |
TC=100℃ | 200 | ||||
Pulsed collector current,tp limited by Tjmax | ICpulse | 400 |
A | ||
Power dissipation | Ptot | 1070 |
W |
Characteristic Values
Item | Symbol | Conditions | Values | Unit | |||
Min. | Typ. | Max. | |||||
Collector-emitter saturation voltage | VCE(sat) | IC=200A, VGE=15V | Tvj=25℃ | 1.65 | 1.95 |
V | |
Tvj=125℃ | 1.90 | ||||||
Tvj=150℃ | 1.92 | ||||||
Gate threshold voltage | VGE(th) | VCE=VGE, IC=8mA | 5.0 | 5.8 | 6.5 |
V | |
Collector-emitter cut-off current | ICES | VCE=1700V, VGE=0V | Tvj=25℃ | 100 | µA | ||
Tvj=150℃ | 5 | mA | |||||
Gate-emitter leakage current | IGES | VCE=0V,VGE=±20V, Tvj=25℃ | -200 | 200 | nA | ||
Gate Charge | QG | VCE=900V, IC=200A , VGE=±15V | 1.2 | μC | |||
Input Capacitance | Cies | VCE=25V, VGE=0V, f =100kHz | 18.0 |
nF | |||
Output Capacitance | Coes | 1.06 | |||||
Reverse Transfer Capacitance | Cres | 0.28 | |||||
Internal gate resistor | RGint | Tvj=25℃ | 4.5 | Ω | |||
Turn-on delay time,inductive load | td(on) | VCC=900V,IC=200A RG=3.3Ω, VGE=±15V | Tvj=25℃ | 188 | ns | ||
Tvj=125℃ | 228 | ns | |||||
Tvj=150℃ | 232 | ns | |||||
Rise Time,inductive load | tr | Tvj=25℃ | 56 | ns | |||
Tvj=125℃ | 68 | ns | |||||
Tvj=150℃ | 72 | ns | |||||
Turn-off delay time,inductive load | td(off) | VCC=900V,IC=200A RG=3.3Ω, VGE=±15V | Tvj=25℃ | 200 | ns | ||
Tvj=125℃ | 600 | ns | |||||
Tvj=150℃ | 620 | ns | |||||
Fall time,inductive load | tf | Tvj=25℃ | 470 | ns | |||
Tvj=125℃ | 710 | ns | |||||
Tvj=150℃ | 745 | ns | |||||
Turn-on energy loss per pulse | Eon | VCC=900V,IC=200A RG=3.3Ω, VGE=±15V | Tvj=25℃ | 33.2 | mJ | ||
Tvj=125℃ | 52.2 | mJ | |||||
Tvj=150℃ | 59.9 | mJ | |||||
Turn off Energy loss per pulse | Eoff | Tvj=25℃ | 49.1 | mJ | |||
Tvj=125℃ | 67.3 | mJ | |||||
Tvj=150℃ | 70.5 | mJ | |||||
SC data | ISC | VGE≤15V, VCC=900V | tp≤10µs Tvj=150℃ | 720 |
A | ||
IGBT thermal resistance,junction-case | RthJC | 0.14 | K /W | ||||
Operating Temperature | TJop | -40 | 175 | ℃ |
Diode
Item | Symbol | Conditions | Values | Unit | |
Repetitive reverse voltage | VRRM | Tvj=25℃ | 1700 |
V | |
Continuous DC forward current | IF | TC=25℃ | 280 |
A | |
TC=100℃ | 200 | ||||
Diode pulsed current,tp limited by TJmax | IFpulse | 400 |
Characteristic Values
Item | Symbol | Conditions | Values | Unit | |||
Min. | Typ. | Max. | |||||
Forward voltage | VF | IF=200A , VGE=0V | Tvj=25℃ | 2.00 | 2.40 |
V | |
Tvj=125℃ | 2.15 | ||||||
Tvj=150℃ | 2.20 | ||||||
Reverse recovery time | trr | IF=200A dIF/dt=-3500A/μs (Tvj=150°C) VR=900V, VGE=-15V | Tvj=25℃ | 140 |
ns | ||
Tvj=125℃ | 220 | ||||||
Tvj=150℃ | 275 | ||||||
Peak reverse recovery current | IRRM | Tvj=25℃ | 307 |
A | |||
Tvj=125℃ | 317 | ||||||
Tvj=150℃ | 319 | ||||||
Reverse recovery charge | QRR | Tvj=25℃ | 45 |
µC | |||
Tvj=125℃ | 77 | ||||||
Tvj=150℃ | 89 | ||||||
Reverse recovery energy loss per pulse | Erec | Tvj=25℃ | 20.4 |
mJ | |||
Tvj=125℃ | 39.6 | ||||||
Tvj=150℃ | 45.2 | ||||||
Diode thermal resistance,junction-case | RthJCD | 0.20 |
K /W | ||||
Operating Temperature | TJop | -40 | 175 | ℃ |
Output characteristic(typical) Output characteristic(typical)
IC = f (VCE) IC = f (VCE)
Tvj= 150°C
IGBT
Transfer characteristic(typical) Switching losses IGBT (typical)
IC = f (VGE) E = f (RG)
VCE = 20V VGE = ±15V, IC = 200A, VCE = 900V
IGBT RBSOA
Switching losses IGBT (typical) Reverse bias safe operating area(RBSOA)
E = f (IC) IC =f (VCE)
VGE = ±15V, RG = 3.3Ω , VCE = 900V VGE = ±15V, RGoff = 3.3Ω, Tvj = 150°C
Typical capacitance as a function of collector-emitter voltage Gate charge (typical)
C = f (VCE) VGE = f (QG)
f = 100 kHz, VGE = 0V IC = 200A, VCE = 900V
IGBT
IGBT transient thermal impedance as a function of pulse width Forward characteristic of Diode (typical)
Zth(j-c) = f (t) IF = f (VF)
Switching losses Diode(typical) Switching losses Diode(typical)
Erec = f (RG) Erec = f (IF)
IF = 200A, VCE = 900V RG = 3.3Ω, VCE = 900V
Diode transient thermal impedance as a function of pulse width
Zth(j-c) = f (t)
The "1700V 200A IGBT Half Bridge Module" integrates two IGBTs in a half-bridge configuration. It's designed for high-power applications, offering precise control over voltage (1700V) and current (200A). Effective cooling is crucial for reliable operation, and detailed specifications can be found in the manufacturer's datasheet.
Circuit diagram headline
Package outlines