The comprehensive efficiency is 20000pcs/h, and the maximum
efficiency is 26000pcs/h.
1) Mounting speed of various
components(resistance,capacitance,chip)20000 pcs/h.
2) Only capacitance or resistance or LED lamp mounting speed is
26000pcs/h.
8pcs high-speed cameras, 2pcs high-definition cameras -- to meet the visual recognition needs of various components.
1) The high-speed camera can meet the visual recognition of
components with diameter less than 10 mm, including
resistance,capacitance, lamp bead, transistors, diodes, etc
2) High definition camera can meet the visual recognition of
components with diameter less than 35mm, mainly including chips,
pins, modules, etc
Resistance and capacitance above 0201, 0.3mm pins chip.
1) Use electric feeder to meet the mounting requirements of 0201
components.
2) High definition camera with precise vision can meet the chip
mounting requirements of QPF, BGA, QFP, etc.
PCB with thickness less than 3mm, 340*560mm.
1) Support PCB with thickness of 1 mm-3 mm.
2) Support minimum width of 50 mm, maximum width of 560 mm PCB,
length of 340 mm PCB.
