Active Member
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[China]
Address: 2F Building C Feiteng Industrial Park, No. 8 HuanZhen Road Shajing Town ShenZhen 518104, China
Contact name:David
Fujintai Technology Co., Ltd. |
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IK-54XF2 Fuji Replacement Parts CP7 CCU K11327 Original New From Japan
Product Specification:
| Brand Name | FUJI CP7 CAMERA |
| Part Number | K11327 |
| Model | IK-54XF2 |
| Warranty | 1 month |
| Usage for Machine | FUJI CP7 |
| Ensure | Test in machine confirmation |
| Guarantee | 100% good working |
| Delivery Methods | Ocean Transport, Air Transport, Air Express Services |
| Delivery Terms | EXW, FOB, CIF |
| Payment Terms | Pay In Advance |
| Services | Supply original new or used and repair service |
Supply Ability:
Supply original new FUJI spare parts at reasonable discount:
Stock Details:
| Description | Part Number | Model | Size | Drive |
| YAMAHA FEEDER | KHJ-MC100-001 | SS | 8MM | ELECTRIC |
| YAMAHA FEEDER | KHJ-MC200-100 | SS | 12/16MM | ELECTRIC |
| YAMAHA FEEDER | KHJ-MC400-002 | SS | 24MM | ELECTRIC |
| YAMAHA FEEDER | KHJ-MC500-001 | SS | 32MM | ELECTRIC |
| YAMAHA FEEDER | KHJ-MC600-001 | SS | 44MM | ELECTRIC |
| YAMAHA FEEDER | KHJ-MC700-001 | SS | 56MM | ELECTRIC |
| YAMAHA FEEDER | KLJ-MC100-004 | ZS | 8MM | ELECTRIC |
| YAMAHA FEEDER | KLJ-MC200-004 | ZS | 12/16MM | ELECTRIC |
| YAMAHA FEEDER | KLJ-MC400-004 | ZS | 24MM | ELECTRIC |
| YAMAHA FEEDER | KLJ-MC500-002 | ZS | 32MM | ELECTRIC |
| YAMAHA FEEDER | KLJ-MC600-002 | ZS | 44MM | ELECTRIC |
| YAMAHA FEEDER | KLJ-MC700-002 | ZS | 56MM | ELECTRIC |
SMT Advantages:
Surface mount technology, SMT and its associated surface mount
devices, SMDs considerably speed up PCB assembly as the components
simply mount on the board.
Look inside any piece of commercially made electronic equipment
these days and it is filled with minute devices. Rather than using
traditional components with wire leads like those that may be used
for home construction and kits, these components are mounted onto
the surface of the boards and many are minute in size.
1. Good mechanical performance under shock and vibration conditions
(partly due to lower mass, and partly due to less cantilevering)
2. Lower resistance and inductance at the connection; consequently,
fewer unwanted RF signal effects and better and more predictable
high-frequency performance.
3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
5. Lower initial cost and time of setting up for mass production, using automated equipment.
