Active Member
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[China]
Address: 2F Building C Feiteng Industrial Park, No. 8 HuanZhen Road Shajing Town ShenZhen 518104, China
Contact name:David
Fujintai Technology Co., Ltd. |
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ORIGINAL SMT MACHINE SPARE PARTS FUJI CP6 FIBER UNIT EP4-321 H3009A
Product Specification:
| Brand Name | FUJI CP6 FIBER UNIT EP4-321 H3009A |
| Part Number | H3009A |
| Model | EP4-321 |
| Warranty | 1 month |
| Usage for Machine | FUJI CP6 CP7 CP8 NXT SMT MACHINE |
| Ensure | Test in machine confirmation |
| Guarantee | 100% good working |
| Delivery Methods | Ocean Transport, Air Transport, Air Express Services |
| Delivery Terms | EXW, FOB, CIF |
| Payment Terms | Pay In Advance |
| Services | Supply original new or used and repair service |
Supply Ability:
Supply original new FUJI spare parts at reasonable prices:
Stock Details:
| Brand name | Part number | Size |
| FUJI | AA84030 | NXT I 8MM W8 |
| FUJI | AA84128 | NXT I 12MM W12 |
| FUJI | AA84228 | NXT I 16MM W16 |
| FUJI | AA84328 | NXT I 24MM W24 |
| FUJI | AA84426 | NXT I 32MM W32 |
| FUJI | AA84525 | NXT I 44MM W44 |
| FUJI | AA84625 | NXT I 56MM W56 |
| FUJI | AA2GZ03 | NXT I 72MM W72 |
| FUJI | AA2HA03 | NXT I 88MM W88 |
| FUJI | AB09910 | NXT II 8MM W08C |
| FUJI | AB10005 | NXT II 12MM W12C |
| FUJI | AB10105 | NXT II 16MM W16C |
| FUJI | AB10205 | NXT II 24MM W24C |
| FUJI | AB10303 | NXT II 32MM W32C |
| FUJI | AB10403 | NXT II 44MM W44C |
| FUJI | AB10503 | NXT II 56MM W56C |
SMT Application:
Surface mount technology, SMT and its associated surface mount
devices, SMDs considerably speed up PCB assembly as the components
simply mount on the board.
Look inside any piece of commercially made electronic equipment
these days and it is filled with minute devices. Rather than using
traditional components with wire leads like those that may be used
for home construction and kits, these components are mounted onto
the surface of the boards and many are minute in size.
1. Good mechanical performance under shock and vibration conditions
(partly due to lower mass, and partly due to less cantilevering)
2. Lower resistance and inductance at the connection; consequently,
fewer unwanted RF signal effects and better and more predictable
high-frequency performance.
3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
5. Lower initial cost and time of setting up for mass production, using automated equipment.
