Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

SMT spare parts Tin Lead Free Solder Welding Dim Bar Sn/AG/Cu Sn/Cu Sn/AG

Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice:

• Anti-oxidation tin lead free bar
• High temperature tin lead free bar
• Low temperature tin lead free bar
• Dim tin lead free bar
• Silver tin lead free bar
• Tin lead free solder bar for other particular applications
• 3.15cm * 1.5cm * 1.0cm
  
  500g/PC
   
  • Eutectic alloy.
  • Bridge-free and icicle-free soldering.
  • Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
  • Good through-hole penetration.
  • Good topside fillet formation.
  • Dross rate equal or lower than tin-lead solder.
  • Does not require a nitrogen atmosphere.
  • Does not erode copper from holes, pads and tracks.
  • Low rate of copper leaching makes it easy to control the copper content of the solder bath.
  • Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
  • Thermal fatigue resistance and creep strength better than tin-lead.
  • Slow, even growth of the intermetallic layer at the solder/substrate interface.
  • Also performs well in selective and dip soldering.