Shenzhen CN Technology Co. Ltd.. |
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OEM ODM android development PCB board Multilayer PCB Board manufacturer
Quick Detail
Product Name: | SMD LED PCB Board |
Used for: | SMT FACTORY Electronic Circuit Board |
Warranty: | 1 Year |
Shipment | by air |
Delivery Time: | 1-2Days |
Our Main Market | Whole of the world |
Less vias
Once the via is selected, the clearance between it and the
surrounding entities must be properly handled, especially the gaps
between the lines and vias that are easily disconnected and the
vias are not connected to the vias. If the wiring is automatic, the
number of vias can be The "On Minimiz8tion" sub-menu selects the
"on" item to automatically resolve. (2) The larger the required
ampacity, the greater the size of the required vias, and the larger
vias used for the connection of the power plane and the formation
to other layers.
Silk screen
Overlay
In order to facilitate the installation and maintenance of the
circuit, the required logo patterns and character codes and the
like are printed on the upper and lower surfaces of the printed
board, such as component labels and nominal values, component
outline shapes, and manufacturer's marks, production dates, and the
like. When many beginners design the silkscreen layer, they only
pay attention to the neat appearance of the text symbols, and
ignore the actual PCB effects. On the printed boards they designed,
the characters were not blocked by the components or they were
invaded by the soldering area, and the components were indexed on
the adjacent components. All of these designs would bring about
great assembly and maintenance. inconvenient. The correct layout
principle of the silk screen layer is: "No ambiguity, no seams,
beautiful appearance."
SMD package
Speciality
Protel package library has a large number of SMD packages, surface
mount devices. The biggest feature of this type of device is that
it is a single-sided distributed elemental pinhole. Therefore, the
surface of the device should be defined so as to avoid "missing
pins". In addition, the relevant text labels of such components can
only be placed along the surface of the component.
Fill area
External Plane and Fill
As the name of both, the network-like filling area is to treat a
large area of copper foil as a mesh, and the filling area is only
a complete reserved copper foil. In the process of designing
beginners, you often cannot see the difference between the two in
the computer. In essence, as long as you enlarge the drawing, you
can see it at a glance. It is because it is not easy to see the
difference between the two, so the use of time does not pay much
attention to the distinction between the two, to emphasize that the
former has a strong role in inhibiting high-frequency interference
in the circuit characteristics, apply to need to do Areas where
large areas are filled are particularly appropriate when certain
areas are used as shielding, partitions, or high-current power
lines. The latter is often used in places where small filling is
required, such as a general line end or a transition area.
Pad
Pad
Pads are the most common and most important concept in PCB design,
but beginners tend to overlook their choices and fixes, and use
circular pads in the design. The pad type of the selected component
must consider the shape, size, layout, vibration and heat
conditions, and force direction of the component. Protel gives a
series of pads of different sizes and shapes in the package
library, such as circles, squares, octagons, circles, and
positioning pads, but sometimes this is not enough and you need to
edit it yourself. For example, for a pad that generates heat and is
subject to greater force and current, it can be designed as a
“teardrop”. In the familiar color TV PCB output transformer pin pad
design, many manufacturers are Adopt this form. In general, besides
the above, the following principles should be considered when
editing the pad by yourself:
(1) When the length of the shape is inconsistent, consider that the
difference between the width of the connecting line and the length
of the specific side of the pad should not be too large;
(2) The need to use asymmetrical pads of long and short lengths
when routing between component lead angles is often more effective;
(3) The size of each component pad hole should be edited and
determined according to the component pin thickness. The principle
is that the hole size is 0.2-0.4 mm larger than the pin diameter.