Main specification:
Product Type: T-960
Number of heating zones: 3 / Down 2
Heating zone length: 960mm
Heating: hot + smart intelligent controlled level of controlled
fast infrared heating
Number of cooling zones: 1
PCB maximum width: 300MM
Transport direction: Left → Right
Transmission: network transmission + chain drive
Conveyor belt speed: 0-1600mm / min
Power supply: 3-phase 5-wire 380V / 220V 50 / 60Hz
Power Peak power: 4.5KW
Warm-up time: 15 minutes
Temperature control range: room temperature ~ 300 ℃
Temperature control: PID loop control
Temperature control accuracy: ± 3 ℃
PCB board temperature distribution deviation: ± 2 ℃
Dimensions (L * W * H): 1450 × 630 × 470
Weight: 90KG
Product Features
1, The machine adopts intelligent controlled horizontal hot air +
intelligent controlled fast infrared heating technology, with a
special design wind wheel wind speed stability, temperature
uniformity for new LED light source, the bulk of uninterrupted
soldering BGA components;
2, the machine is equipped with crawler, five-zone heating system,
independent of each temperature zone using forced circulation,
independent PID control, upper and lower independent heating, the
temperature of the furnace chamber accurate, uniform, large heat
capacity, fast heating from room temperature to work temperature
for 15 minutes;
3, intelligent curve heating, large capacity curve selection, with
eight technology curve can meet the requirements of all types of
welding processes;
4, programmable control technology, the preset memory function
curve, according to your preset curve automate the entire welding
process;
5, using thermocouple, and add a compensation circuit, so that a
more accurate temperature measurement, so that the curve is more
perfect;
6, PID intelligent temperature control technology, allowing more
accurate temperature control, no import high current solid state
relay contact output can effectively avoid rapid warming or heating
caused by continuous chip or circuit board is damaged, the entire
welding process more scientific and safety;
7. The transmission system adopts imported inverter motor, PID
closed loop speed control, with 1: 150 imported turbine reducer,
smooth operation, adjustable speed range 0-1600mm / min.
8. Using independent wheel structure and the care level, special
stainless steel mesh belt B word, durable wear-resistant smooth
operation, precise speed of up to ± 10mm / min;
9. independent cooling zones, to ensure that the low temperature
required for the plate when the PCB board;
10, a friendly man-machine interface, perfect LCD without a PC
connected with the whole heating process at a glance;
11, resolute appearance, compact size, reflected in
technology-based start to finish. Mesa-type placement mode, so you
have more space; the simple instructions, so you'll see.
Reflow machine instructions
1, after the boot into setting interface. Press F2 curve selection,
press F1 conduct point selection, press F3 / F4 corresponding zone
temperature setting on the up / down, press F5 to enter the heated
interface;
Under 2, five small red switch 1/2/3/4/5 control the first
temperature zone / warm zone on the first / second temperature zone
/ third temperature zone / area at a second temperature;
3, when the temperature reaches equilibrium, open the motor switch,
and adjust the conveyor speed;
4, press F2 to stop heating, and enter the setup interface;
5, the factory, each temperature curve for the following purposes:
Curve 2 for less than leaded solder welding; eg: 85Sn / 15Pb 70Sn /
30Pb and so on;
Curves 3 and 4, is suitable for welding relatively large amount of
lead solder; as: 63Sn / 37Pb 60Sn / 40Pb and the like;
Curves 5,6, suitable for welding of high melting point lead-free
solder; such as: Sn / Ag3.5; Sn / Cu.75 Sn / Ag4.0 / Cu.5 Sn95.5 /
Ag3.8 / Cu0.7 etc;
Curves 7-8 for solder melting point lead-free solder; such as: Sn /
Ag2.5 / Cu.8 / Sb.5; Sn / Bi3.0 / Ag3.0 etc;
Recommended veneer welding cycle curve 1,3,5,7 480S, curve 2,4,6,8
recommend veneer welding cycle 280S.
6, to remind
①, welding chips, depending on the size and welding process
requirements of the chip, select the appropriate curve.
Distribution ②, heating temperature zones for the upper three
zones, the lower two zones, corresponding to the first paragraph of
the heating curve / third / fourth paragraph / paragraph / fifth
paragraph.
③, the current production and use of solder there are many, each
company has chosen very different articles about theoretical
analysis and test analysis very much. For these reasons, the
company launched a product that can preset eight curves, each curve
has five segments, each segment of the heating time can be changed.
The user can re-set the heating curve according to the heating
temperature and time required to solder.
Reflow profile settings based on
1. Principles and reflow temperature profile
When the PCB entering the
heating zone (drying zone), the solder paste, the solvent was
evaporated off gas, while the solder paste flux wetting the pad,
the tip member and the pin, the solder paste to soften, collapse,
covering the weld disc, the pads, pins and oxygen element
isolation; PCB into the holding area, so that PCB and components
are fully preheat PCB to prevent excessive heating pads suddenly
entered damaged PCB and components; when the PCB into the weld zone
the temperature rose rapidly to reach a molten state so that the
solder paste, liquid solder pads on the PCB, PCB component side
into the cooling zone, so that solder solidification, complete
reflow.
Temperature profile is critical
to ensure the quality of welding, heating slope and peak solder
temperature and actual temperature curve temperature curve should
be basically the same. 160 ℃ before heating rate controlled at
about 1 ℃, if the ramp rate too fast, on the one hand to make
components and PCB heat too fast, easy to damage components, could
easily lead to PCB deformation; on the other hand, the solder paste
is too volatile solvent fast, easy to spill metal components,
produce solder balls. The peak temperature is generally set higher
than the solder melts at a temperature of about 20 ℃ -40 ℃, reflux
time of 10S-60S, low or reflow peak temperature short time, make
welding insufficient cause severe paste does not melt; peak over
high or long refluxing time, resulting in oxidation of the metal
powder, affecting the quality of welding, and even damage to
components and PCB.
2, the temperature curve settings
Be set according to the
temperature curve using solder paste and solder principles provided
above. Different metal content of solder paste application of
different temperature curve, according to the temperature profile
of the solder paste manufacturers to provide a specific set reflow
profile. Further, also with the temperature curve of the heating of
the PCB, the density of components, size and so on. Under normal
circumstances, lead-free soldering temperature should be higher
than the melting point of about 40C.
Temperature zone settings
1. Set the zone temperature and belt speed (usually given when the
manufacturer conditioners by) to the starting value.
2. For a cold furnace, is preheated for 20-30 minutes.
3, when the temperature reaches equilibrium, the sample was heated
to reflux PCB system, which is set so that the critical point of
solder paste to reflux. Should not happen by four reflux treatment
reflux occurs when the excesses, to maintain the correct
temperature setting minus the proportion of support, and let the
PCB back through the system until the reflux critical point, turn
to step 4 if and only if there is no or just reflux, whichever
occurs .
4, if a reflux does not occur, the belt speed reducing 5-10%. For
example: when the tape speed is not present at reflux for 500mm /
min, is reduced to adjust 460mm / min or so. Belt speed 10%
reduction in general will increase product reflux temperature of
about 30F. Or belt speed without changing the premise,
appropriately increasing the set temperature, increase the
amplitude of the temperature curve has been the standard reference
for the center, according to PCB through the gap between the
magnitude of the actual temperature curve and standard curve
adjustment system, generally about 5 ℃ for each adjustment
gradient, adjusting the set temperature should pay special
attention to not exceed the capacity of the PCB and components.
5, and then make the PCB board by reflow system on the new tape
speed or set the temperature, with or without reflux occurs, turn
the adjustment to redo step 4, otherwise go to step 6, the
fine-tuning by the temperature curve.
6, by the complexity of the temperature curve with the PCB and make
appropriate adjustments. You can fine-tune the tape speed two
scale, lower belt speed will improve the product by the
temperature, on the contrary increase the belt speed will be
reduced by the product temperature.
7. Tip: Generally the PCB-mounted components after reflow system
without fully reflux can be adjusted after the second into the
return system for welding, usually does not cause an adverse impact
on the PCB and components. 8, the temperature is set from low to
high in general, if the amplitude exceeds the reflux temperature by
the temperature is too large, the belt speed should be a
corresponding increase or decrease to adjust the set temperature,
in particular with four opposite operation.
