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10M16SCU169I7G Programming IC Chip Field Programmable Gate Array (FPGA) 169-LFBGA

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Shenzhen Sai Collie Technology Co., Ltd.

10M16SCU169I7G Programming IC Chip Field Programmable Gate Array (FPGA) 169-LFBGA

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Product Details

10M16SCU169I7G Programmable IC Chip
Field Programmable Gate Array (FPGA) IC 130 562176 16000 Package 169-LFBGA

 

Number of LABs/CLBs
1000
Number of Logic Elements/Cells
16000
Total RAM Bits
562176
Number of I/O
130
Voltage - Supply
2.85V ~ 3.465V
Mounting Type
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
Supplier Device Package
169-UBGA (11x11)
 
10M16SCU169I7G DC Characteristics
Supply Current and Power Consumption
Intel offers two ways to estimate power for your design--the Exce-based Early Power Estimator (EPE) and the Intel OuartusPrime Power Analyzer feature.
Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides amagnitude estimate of the device power because these currents vary greatly with the usage of the resources
The Intel Quartus Prime Power Analyzer provides better quality estimates based on the specifics of the design after youcomplete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimatedsignal activities that, when combined with detailed circuit models, yield very accurate power estimates.
I/O Pin Leakage Current
The values in the table are specified for normal device operation. The values vary during device power-up. This applies for allVccio settings (3.3,3.0, 2.5,1.8, 1.5,1.35,and 1.2 V).
10 A I/0 leakage current limit is applicable when the internal clamping diode is off. A higher current can be the observedwhen the diode is on.
Input channel leakage of ADC I/0 pins due to hot socket is up to maximum of 1.8 mA. The input channel leakage occurs whenthe ADC IP core is enabled or disabled. This is applicable to all Intel MAX 10 devices with ADC IP core, which are 10M04,10M08, 10M16, 10M25, 10M40, and 10M50 devices. The ADC I/0 pins are in Bank 1A.
 
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