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[China]
Trade Verify
Address: NO54 South Jinhu Road ChenJiang Town Zhongkai DISTRICT Huizhou 516229 CHINA
Contact name:LINK-PP Global
LINK-PP INT'L TECHNOLOGY CO., LIMITED |
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Verified Suppliers
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1.RJ-45 needs to be matched FCC standard.
2.Complies with requirement of IEEE802.3af standards.
3.RJ-45 connector integrated with
transformer/impedance resistor/high voltage capacitor.
4.Size same as RJ-45 connector to save PCB board space.
5.Reduced EMI radiation to improve EMI performance.
6.Design for 5G BASE transmission over UTP-5 cable.
7.Compliance with ROHS requirements.
8.Operating temperature range: -40℃ to +85℃
9.Storage temperature range: -25℃ to +85℃.
10.Designing Model: 【ARJM11A1-811-AB-EW2】
11.Mass Production Model:【LPJkXXXXNL】
MAG.REVERSE LATCH ,
LED optional ; EMI-finger Optional.
| Part Number | ARJM11A1-811-AB-EW2 | |
|---|---|---|
| Part Status | Active | |
| Connector Type | RJ45 | |
| Number of Ports | 1 | |
| Number of Rows | 1 | |
| Applications | 5G Base-T, AutoMDIX | |
| Mounting Type | Through Hole | |
| Orientation | 90° Angle (Right) | |
| Termination | Solder | |
| Height Above Board | 0.535" (13.59mm) | |
| LED Color | Green - Yellow | |
| Number of Cores per Jack | 8 | |
| Shielding | Shielded, EMI Finger | |
| Features | Board Lock | |
| Tab Direction | Down | |
| Contact Material | - | |
| Contact Finish | Gold | |
| Operating Temperature | -40°C ~ 85°C | |
| Contact Finish Thickness | 6.00µin (0.152µm) |
Designed to support applications, such as ADSL modems, LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...
18 years production experience,
2600 staff,
100% test
Flexible delivery time
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly
