J1B1211CFD Single Port with10 /100Base-T Magnetic LPJ4013AHNL
IP-PBX
1.10/100 Base-T Applications
2.8P 8C Integrated Filter Rj45 Female Jack
3.J1B1211CFD
4. LPJ4013AHNL
4. LED optional, EMI-finger Optional.
Description
1X1 RJ45 Magjack with/without leds, meeting IEEE 802.3u
1. Product Type
Features:
1) Product Type = Connector
2) Jack Type = RJ45
3) Profile = Standard
4) PCB Mounting Orientation = Side Entry (Right Angle
2. Mechanical Attachment:
1) Jack Configuration = 1 x 1
3. Electrical Characteristics:
1) Shielded = Yes
4. Termination Related Features:
1) EMI Finger - Bottom = Without
2) Termination Method = Solder
5. Body Related Features:
1) Port Configuration = Single/Multi
2) EMI Fingers -Top and Sides = With/ Without
3) Latch Orientation = Standard - Latch Down
4) PCB Tail Length
6. Contact Related Features:
1) Preloaded = Yes
2) Contact Termination Type = Through Hole/Surface Mount
7. Housing Related Features:
1) Connector Style = Jack
8. Industry Standards:
1) RoHS/ELV Compliance = RoHS compliant, ELV compliant
2) Lead Free Solder Processes = Wave solder capable to
240°C,
Wave solder capable to
260°C, Wave solder capable to 265°C
3) RoHS/ELV Compliance History = Always was RoHS compliant
9. Identification Marking:
1) Left LED Color (Position #1) = Green - 250 ohm resistor
2) Right LED Color (Position #2) = Green - 250 ohm resistor
10. Conditions for Usage:
1) Applies To = Printed Circuit Board
2) Environmental Conditions = Office / Premises
3) Operating Temperature (°C ) = 0 - 70/-40 - +85
11.Hipot:
1500Vrms MIN
Applications For Terminal User
Used for networking and communication equipments such as HUB, PC
card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP
gateways setup,Border Gateway Protocol,fast ethernet switch ...
Competitive Advantage
18 years production experience,
2600 staff,
100% test
Flexible delivery time
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil
, Flextronics ,Cypress, Freescale,EKF.......
EMS Application
Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
