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Rogers RO4360 High Frequency PCB 24mil Double Sided RF Circuit Board With Immersion Gold for Ground-based Radar
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.
RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.
RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.
Features and benefits:
1. Thermoset resin system specially formulated to meet 6.15 Dk
1). Ease of fabrication / processes similar to FR-4
2). Material repeatability
3). Low loss
4). High thermal conductivity
5). Lower total PCB cost solution than competing PTFE products,
2. Low Z-axis CTE / High Tg
1). Design flexibility
2). Plated through-hole reliability
3). Automated assembly compatible
3. Environmentally friendly
1) Lead free process compatible
4. Regional finished goods inventory
1). Short lead times / quick inventory turns
2). Efficient supply chain
Some Typical Applications:
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar
PCB Capability
| PCB Material: | Hydrocarbon Ceramic-filled Thermoset Materials |
| Designation: | RO4360G2 |
| Dielectric constant: | 6.15 ±0.15 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of RO4360G2
| RO4360G2 Typical Value | |||||
| Property | RO4360G2 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz/23℃ | |||||
| Dissipation Factor,tanδ | 0.0038 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Conductivity | 0.75 | W/mK | 50℃ | ASTM D-5470 | |
| Volume Resistivity | 4.0 X 1013 | Ω.cm | Elevated T | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 9.0 X 1012 | Ω | Elevated T | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 784 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Tensile Strength | 131 (19) 97(14) | X Y | MPa (kpsi) | 40 hrs 50%RH/23 | ASTM D638 |
| Flexural Strength | 213(31) 145(21) | X Y | Mpa (kpsi) | 40 hrs 50%RH/23 | IPC-TM-650, 2.4.4 |
| Coefficient of Thermal Expansion | 13 14 28 | X Y Z | ppm/℃ | -50 ℃to 288℃ After Replicated Heat Cycle | IPC-TM-650, 2.1.41 |
| Tg | >280 | ℃ TMA | IPC-TM-650 2.4.24.3 | ||
| Td | 407 | ℃ | ASTM D3850 using TGA | ||
| T288 | >30 | Z | min | 30 min / 125℃ Prebake | IPC-TM-650 2.2.24.1 |
| Moisure Absorption | 0.08 | % | 50℃/48hr | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Thermal Coefficient of er | -131 @10 GHz | Z | ppm/℃ | -50℃ to 150 ℃ | IPC-TM-650, 2.5.5.5 |
| Density | 2.16 | gm/cm3 | RT | ASTM D792 | |
| Copper Peel Stength | 5.2 (0.91) | pli (N/mm) | Condtion B | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 File QMTS2. E102765 | |||
