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20mil RF-35 1oz Immersion Tin PCB With White Silkscreen For Passive Components

Bicheng Electronics Technology Co., Ltd

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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103

Contact name:Ivy Deng

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20mil RF-35 1oz Immersion Tin PCB With White Silkscreen For Passive Components

Country/Region china
City & Province shenzhen guangdong
Categories Electrical Wires
InquireNow

Product Details

Introducing our newly shipped 2-layer rigid PCB, specifically designed to meet the requirements of various applications such as power amplifiers, filters, and couplers. This PCB is crafted using Taconic ORCER family, a high-quality PTFE Ceramic-woven glass reinforcement material, offering exceptional performance and reliability.

 

The PCB material features a Dielectric Constant of 3.5 at 1.9GHz, ensuring efficient signal transmission and minimal signal loss. With a low Dissipation Factor of 0.0018 at 1.9GHz, this PCB exhibits excellent electrical characteristics, contributing to optimal circuit performance. It also boasts a remarkable Dielectric Breakdown strength of 41 kV, ensuring durability and protection against electrical breakdowns.

 

The Taconic ORCER material demonstrates a low coefficient of thermal expansion (CTE) of 19 ppm/°C and 24 ppm/°C in the x-y direction, and 64 ppm/°C in the z direction. This dimensional stability helps maintain the integrity of the PCB under varying temperatures and ensures reliable performance over time.

 

Benefiting from its low-cost advantage, this PCB offers exceptional peel strength, further enhancing its durability and resistance to delamination. The exceptionally low Dissipation Factor contributes to efficient signal transmission without significant energy loss. Additionally, its low moisture absorption and enhanced surface smoothness add to its overall reliability and performance.

 

The stackup of this PCB consists of two copper layers, each with a thickness of 35 μm, sandwiching the RF-35 core with a thickness of 20mil (0.508 mm). This construction ensures optimal signal integrity and structural integrity.

 

With a board dimension of 115mm x 59 mm (+/- 0.15mm), this PCB provides ample space for your circuit design while maintaining precise fitment. The minimum trace/space of 6/4 mils allows for intricate circuit routing, and the minimum hole size of 0.3mm facilitates efficient component integration. The finished board thickness of 0.6mm and 1oz (1.4 mils) outer layer copper weight strike a balance between flexibility and durability.

 

For surface finish, the Immersion Tin coating ensures excellent solderability and corrosion resistance. The top silkscreen is presented in white, providing clear component identification. The absence of bottom silkscreen and solder mask allows for flexibility in customization.

Prior to shipment, each PCB undergoes a rigorous 100% electrical test, ensuring its functionality and adherence to IPC-Class-2 quality standards.

 

The Gerber RS-274-X artwork format is supplied, enabling seamless integration into your manufacturing process.

 

This PCB boasts a total of 25 components and 168 pads, including 112 thru-hole pads and 56 top SMT pads. With 211 vias and 9 nets, efficient routing and connectivity are ensured, further enhancing the overall performance of your circuit projects.

 

For any technical inquiries or further information, please do not hesitate to reach out to Ivy at sales10@bichengpcb.com. We are dedicated to providing exceptional customer support and addressing any questions you may have.

 

Dielectric Constant @ 1.9 GHzIPC-TM 650 2.5.5 3.5 3.5
Dissipation Factor @ 1.9 GHzIPC-TM 650 2.5.5 0.0018 0.0018
Moisture Absorption (.060")IPC-TM 650 2.6.2.1%0.02%0.02
Peel Strength (1/2 oz. copper)IPC-TM 650 2.4.8lbs./linear inch>8.0N/mm>1.5
Peel Strength (1 oz. copper)IPC-TM 650 2.4.8lbs./linear inch>10.0N/mm>1.8
Dielectric BreakdownIPC-TM 650 2.5.6kV41kV41
Volume ResistivityIPC-TM 650 2.5.17.1Mohm/cm1.26 x 109Mohm/cm1.26 x 109
Surface ResistivityIPC-TM 650 2.5.17.1Mohm1.46 x 108Mohm1.46 x 108
Arc ResistanceIPC TM 650 2.5.1seconds>180seconds>180
Flexural Strength LengthwiseASTM D 790psi>22,000N/mm2>152
Flexural Strength CrosswiseASTM D 790psi>18,000N/mm2>124
Thermal ConductivityASTM F 433W/m/K0.24W/m/K0.24
Tensile Strength LengthwiseASTM D 638psi27,000N/mm2187
Tensile Strength CrosswiseASTM D 638psi21,000N/mm2145
Dimensional Stability LengthwiseIPC-TM 650 2.4.39in/in0.00004mm/mm0.00004
Dimensional Stability CrosswiseIPC-TM 650 2.4.39in/in-0.0001mm/mm-0.0001
x-y CTEASTM D 3386 (TMA)ppm/°C19-24ppm/°C19-24
z CTEASTM D 3386 (TMA)ppm/°C64ppm/°C64
FlammabilityUL-94 V-0 V-0
HardnessRockwell M Scale 34 34


Unleashing the Power of RF-35: A Cutting-Edge PCB Material


Introduction:
In the realm of high-frequency applications, RF-35 PCBs have emerged as a game-changer, delivering exceptional performance and reliability. With its unique properties and advanced features, RF-35 has become the go-to choice for engineers seeking optimal signal integrity and enhanced circuit performance.

 

Key Electrical Properties of RF-35:
RF-35 boasts a dielectric constant of 3.5 at 1.9 GHz, ensuring efficient signal transmission and minimizing signal loss. Its impressively low dissipation factor of 0.0018 at 1.9 GHz further enhances electrical performance, allowing for high-fidelity signal transfer. These properties make RF-35 ideal for power amplifiers, filters, and other RF applications.

 

Mechanical Strength and Dimensional Stability:
RF-35 exhibits remarkable mechanical strength and dimensional stability. With a peel strength of over 8.0 lbs./linear inch (or >1.5 N/mm), it provides exceptional durability and resistance to delamination. Its low moisture absorption of 0.02% ensures reliable performance even in demanding environments. Additionally, RF-35's enhanced surface smoothness contributes to optimal circuit assembly and signal integrity.

 

Dielectric Breakdown and Thermal Conductivity:
RF-35 surpasses expectations when it comes to dielectric breakdown, with a strength of 41 kV. This feature ensures reliable insulation and protection against electrical breakdowns, enhancing the longevity of electronic systems. Moreover, RF-35's thermal conductivity of 0.24 W/m/K facilitates effective heat dissipation, mitigating the risk of overheating and ensuring stable circuit operation.

 

 

Applications in Power Amplifiers, Filters, and Passive Components:
RF-35 finds wide application in power amplifiers, where its low loss and excellent electrical performance enable efficient power delivery. It is also well-suited for filters and couplers, where controlled impedance transmission lines are crucial for precise signal filtering. Additionally, RF-35 enhances the performance of passive components, contributing to overall circuit efficiency.

 

Quality Standards and Global Availability:
RF-35 PCBs adhere to IPC-Class-2 quality standards, ensuring consistency and reliability in manufacturing. With worldwide availability, engineers and designerscan easily access RF-35 for their projects, regardless of their location.

 

Conclusion:
RF-35 PCBs have revolutionized high-frequency circuit design, offering exceptional electrical properties, mechanical strength, and dimensional stability. With its low moisture absorption, high peel strength, and reliable dielectric breakdown, RF-35 ensures long-lasting performance and signal integrity. Its thermal conductivity and versatility in power amplifiers, filters, and passive components make it a top choice for engineers aiming to optimize their RF applications. Embrace the power of RF-35 and unlock a new realm of possibilities in your designs. Trust in its quality standards and global availability to propel your projects forward.

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