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20mil Double Sided 1oz Copper Immersion Silver PCB Board RT / Duroid 6035HTC

Bicheng Electronics Technology Co., Ltd

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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103

Contact name:Ivy Deng

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20mil Double Sided 1oz Copper Immersion Silver PCB Board RT / Duroid 6035HTC

Country/Region china
City & Province shenzhen guangdong
Categories Electrical Wires
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Product Details

Our newly shipped 2-layer rigid PCB has been crafted to meet your electronic needs, offering exceptional performance and reliability. Constructed from high-quality Rogers RT/duroid 6035HTC ceramic filled PTFE composites, this PCB ensures superior electrical properties and stability. With a process DK of 3.5 at 10 GHz and a dissipation factor of 0.0013 at the same frequency, excellent signal integrity is achieved. It is designed to operate flawlessly in temperatures ranging from -40℃ to +85℃, making it suitable for a wide range of applications.

 

The stackup of our 2-layer rigid PCB comprises two copper layers with a thickness of 35 μm, sandwiching a Rogers RT/duroid 6035HTC substrate measuring 0.508 mm (20mil). This construction guarantees durability and efficient signal transfer for your circuit designs.

 

When it comes to construction details, precise board dimensions of 89.24mm x 11.8mm have been achieved, with a tolerance of +/- 0.15mm. This ensures accurate dimensions tailored to your specific requirements. A minimum trace/space width of 5/5 mils allows for intricate circuit routing, while a minimum hole size of 0.35mm provides flexibility for component mounting. This PCB does not incorporate blind vias, streamlining the manufacturing process.

 

With a finished board thickness of 0.63mm and 1 oz (1.4 mils) outer layer copper weight, durability and excellent conductivity are guaranteed. The via plating thickness has been set at 20 μm, ensuring reliable connections. Immersion Silver serves as the surface finish, offering excellent solderability and corrosion resistance. Neither the top nor bottom silkscreen is present, giving the PCB a clean and minimalistic appearance. The top solder mask is green, providing effective protection, while the bottom solder mask is absent.

 

To ensure quality, each PCB undergoes 100% electrical testing prior to shipment, guaranteeing optimal performance and reliability.

 

Impressive statistics accompany this PCB, including support for up to 128 components, a total of 112 pads, 81 thru hole pads, 20 top SMT pads, and 11 bottom SMT pads. With 100 vias and 6 nets, ample connectivity options are available for your circuit designs.

The artwork for this PCB is supplied in Gerber RS-274-X format, compatible with standard PCB design software. It adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and compliance with industry standards.

 

Our 2-layer rigid PCB is available for worldwide purchase, catering to customers globally. Should you have any technical questions or inquiries, you can drop an email to sales10@bichengpcb.com. Ivy is ready to provide assistance and furnish further information about our 2-layer rigid PCB.

Choose our high-quality PCB for your electronic projects and experience exceptional performance and reliability.

 

Dielectric Constant,εProcess3.50±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.6Z 8 GHz - 40 GHzDifferential Phase Length Method
Dissipation Factor0.0013Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-66Zppm/℃-50 ℃to 150℃mod IPC-TM-650, 2.5.5.5
Volume Resistivity108 MΩ.cmAIPC-TM-650, 2.5.17.1
Surface Resistivity108 AIPC-TM-650, 2.5.17.1
Dimensional Stability-0.11 -0.08CMD MDmm/m (mils/inch)0.030" 1oz EDC foil Thickness after etch '+E4/105IPC-TM-650 2.4.39A
Tensile Modulus329 244MD CMDkpsi40 hrs @23℃/50RHASTM D638
Moisure Absorption0.06 %D24/23IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃)19 19 39X Y Zppm/℃23℃ / 50% RHIPC-TM-650 2.4.41
Thermal Conductivity1.44 W/m/k80℃ASTM C518
Density2.2 gm/cm323℃ASTM D792
Copper Peel Stength7.9 pli20 sec. @288 ℃IPC-TM-650 2.4.8
FlammabilityV-0   UL 94
Lead-Free Process CompatibleYes    


Unveiling the Impressive Properties of RT/duroid 6035HTC: Empowering High-Performance PCBs

 

The RT/duroid 6035HTC material, utilized in our PCB construction, boasts impressive properties that contribute to its high-performance capabilities. With a dielectric constant (ε) of 3.50±0.05 at 10 GHz/23℃, as determined by the IPC-TM-650 2.5.5.5 Clamped Stripline method, it ensures efficient signal transmission and reliable electrical characteristics. The dielectric constant (ε) design value stands at 3.6, making it suitable for frequencies ranging from 8 GHz to 40 GHz, as per the Differential Phase Length Method.

 

When it comes to dissipation factor, the RT/duroid 6035HTC exhibits a remarkably low value of 0.0013 at 10 GHz/23℃, according to the IPC-TM-650 2.5.5.5 test. This low dissipation factor ensures minimal signal loss and preserves signal integrity. Additionally, the thermal coefficient of the dielectric constant is measured at -66 ppm/℃ within the temperature range of -50℃ to 150℃, adhering to the IPC-TM-650 2.5.5.5 standard.

The RT/duroid 6035HTC material showcases excellent electrical insulation properties with a volume resistivity of 10^8 MΩ·cm and a surface resistivity of 10^8 MΩ, as determined by the IPC-TM-650 2.5.17.1 test. These characteristics guarantee effective electrical insulation and mitigate the risk of surface leakage.

 

 

In terms of dimensional stability, the RT/duroid 6035HTC offers a low coefficient of thermal expansion (CTE) of 19 ppm/℃ in the X, Y, and Z directions, as measured at 23℃/50% RH in accordance with the IPC-TM-650 2.4.41 method. This exceptional property ensures that the PCB maintains its structural integrity and dimensions even under extreme temperature fluctuations.

The material's tensile modulus measures at 329 kpsi in the MD (machine direction) and 244 kpsi in the CMD (cross-machine direction) after a 40-hour test at 23℃/50% RH, following ASTM D638. This high tensile modulus contributes to the PCB's strength, stability, and overall structural performance.

 

With a moisture absorption rate of 0.06% (D24/23, IPC-TM-650 2.6.2.1, ASTM D570), the RT/duroid 6035HTC demonstrates superior resistance to moisture absorption. This property ensures the PCB's reliability and consistent performance, even in environments with high humidity levels.

The material possesses a thermal conductivity of 1.44 W/m/k at 80℃, as determined by ASTM C518. This high thermal conductivity facilitates efficient heat dissipation, effectively preventing overheating and maintaining optimal operating temperatures for electronic applications.

With a density of 2.2 gm/cm3 at 23℃, as determined by ASTM D792, the RT/duroid 6035HTC strikes a balance between lightweight design and structural integrity, making it an ideal choice for PCB applications.

 

In terms of reliability, the material exhibits a copper peel strength of 7.9 pli, tested for 20 seconds at 288℃ according to IPC-TM-650 2.4.8. This remarkable strength ensures robust adhesion between copper layers, effectively preventing delamination and enhancing the PCB's longevity.

The RT/duroid 6035HTC has achieved a flammability rating of V-0 according to the UL 94 standard, demonstrating its exceptional fire resistance capabilities.

 

Furthermore, the material is compatible with lead-free processes, aligning with environmental regulations and promoting eco-friendly manufacturing practices.

 

By incorporating the RT/duroid 6035HTC material into our PCBs, we ensure exceptional performance, reliability, and durability. Its remarkable electrical properties, dimensional stability, thermal conductivity, and reliability make it the optimal choice for high-performance PCB applications.

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