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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
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When it comes to a printed circuit board (PCB), selecting the right material, stackup, and construction details can make all the difference. In this article, we will provide an overview of a specific PCB that utilizes RT/duroid 5880 PTFE Random Glass Fiber material and has a 2-layer rigid stackup.
The PCB Material is RT/duroid 5880. This material is known for its high performance, low loss, and lead-free composition, making it more environmentally friendly. It can operate within a temperature range of -40℃ to +85℃.
The stackup for this 2-layer rigid PCB consists of a finished copper thickness of 35um, an RT/duroid 5880 dielectric thickness of 31mil, and another finished copper thickness of 35um. The finished board thickness is 0.9mm, and the finished copper weight is 1 oz (1.4 mils) for all layers.
The via plating thickness is 1 mil, and the surface finish is Electroless Nickle Immersion Gold (ENIG). There is no top or bottom silkscreen or solder mask, and there are no silkscreen on the solder pads.
Regarding construction details, the PCB has a dimension of 195mm x 182mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 4/7 mils, and the minimum hole size is 0.25mm. There are no blind or buried vias, and the PCB has undergone 100% electrical testing to ensure its quality.
The PCB contains 54 components, 91 total pads, 39 thru-hole pads, and 52 top SMT pads, with 43 vias and 12 nets. This design uses PCBDOC artwork, and it conforms to the IPC-Class-II standard. Our service area is worldwide, and if you have any technical questions about this specific PCB, please don't hesitate to contact Ivy at sales10@bichengpcb.com.
In conclusion, selecting the right materials and construction details for a PCB is crucial for achieving optimal performance and functionality. This article has provided an overview of the specific PCB material, stackup, and construction details for this particular design, emphasizing the importance of considering specific requirements for each project. At bicheng, we specialize in supplying high-quality PCBs that meet the highest standards of quality and performance. Contact us today to learn more about how we can help you with your next project.
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
More about bicheng.
Quality Policy
Bicheng has developed series of management procedures and
approaches to assure that PCBs are in compliance with the
customers' requirements, inclusive of selection of the vendors,
work in progress inspection, outgoing delivery inspection and
customer service etc.
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng
will appraise and rank suppliers every year to guarantee the
materials supplied are meeting Bicheng’s requirements. Furthermore,
Bicheng continuously develop suppliers and supervise them to
improve their quality and environment management basing on the
systems of ISO9001 and ISO14001.
Contract Evaluation
Bicheng shall review and verify customer's requirements to make
sure that we have the capability to satisfy customers' requirements
including specifications, delivery and other demands prior to
accepting an order.
