20 Mil RO4360G2 RF PCB Board 2 Layer Rigid PCB Board

Now we are introducing our newly shipped 2-layer rigid PCB, which provide reliable and efficient operation for a wide range of applications. The PCB material is constructed using RO4360G2 Hydrocarbon/Ceramic/Woven Glass and a lead-free process for environmentally conscious manufacturing. The PCB is capable of operation within a temperature range of -40℃ to +85℃.

The board dimensions measure 43mm x 86mm with a tolerance of +/- 0.15mm, and a minimum trace/space of 7/9 mils and a minimum hole size of 0.3mm are utilized. No blind or buried vias are used in the construction of this PCB, with a finished board thickness of 0.6mm and finished Cu weight of 1 oz (1.4 mils) all layers. The via plating thickness is 1 mil, and the surface finish is Immersion Silver. No silkscreen on solder pads is present, and 100% Electrical test is utilized to ensure reliability.

The PCB statistics indicate 35 components with a total of 90 pads, 26 thru hole pads, and 64 top SMT pads, with no bottom SMT pads. There are 46 vias and 12 nets. The type of artwork supplied is Gerber RS-274-X.

RO4360G2 - The Ultimate PCB Material for High-Frequency Applications

Selecting the right PCB material is a critical aspect of designing high-frequency applications, where performance is paramount. One material that has gained increasing popularity in high-frequency PCB is RO4360G2. This hydrocarbon/ceramic/woven glass-based material boasts excellent dielectric properties and superior performance, making it an ideal choice for high-frequency applications.

Properties and Characteristics of RO4360G2 Material:

RO4360G2 material features a dielectric constant of 6.15±0.15 and a low dissipation factor of 0.0038, making it an optimal choice for high-frequency applications. This material also exhibits good thermal conductivity, electrical strength, and mechanical properties, enabling it to withstand high temperatures and harsh environments.

Advantages of RO4360G2 Material in High-Frequency Applications:
RO4360G2 material offers several advantages for high-frequency PCB designs, including improved signal integrity, reduced loss, and enhanced performance. This material also provides greater design flexibility and can be used for a wide range of applications, such as aerospace, telecommunications, and medical devices.

Applications of RO4360G2 PCB Material:
RO4360G2 material is suitable for various high-frequency applications, including RF/microwave components, antennas, and filters. This material is also widely used in the aerospace industry for radar systems and communication equipment.

Conclusion:
RO4360G2 PCB material is the ultimate choice for high-frequency applications, offering superior performance and reliability. By selecting RO4360G2 material, designers can achieve optimal signal integrity, reduced loss, and enhanced performance in their high-frequency PCB.