Fr4 Polyimide 6 Layer Flex Rigid PCB Design HASL Immersion Gold

6 Layer Rigid&Flex PCB Fr4 Polymide Customized Circuit Board Manufacture

With more than 500 experienced workers and technical team, IBE can offer 15,000 square meters per month. Plant covering 200,000 square meters with the imported and maximum precision facilities, manufacturing lines are totally automation, Meanwhile, you can be sure of quality with our ISO 9001:2008, UL, ISO14001, ROHS and TS16949 approval.Our products include 1-10 layers of simple to high density boards;flex circuits and rigid flex boards, which are the substrate of consumer electronic merchandize, communication device, industrial automation machine, IT product, medical equipment and automotive electronics etc.We handle all types of pcb assembly, from basic through hole PCB assembly to standard surface mount PCB assembly to ultra-fine pitch BGA assembly. Our engineers work with customers from across all fields including telecommunications, aviation, consumer electronics, wireless, medial, automotive and instrumentation.

PCBA Capability

The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.

Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.

PCB Manufacturing Capability
PCB Layers:	1Layers to 18 layer (Max)
Board thickness:	0.13~6.0mm
Min line width/space:	3mil
Min mechanical hole size:	4mil
Copper thickness:	9um~210um(0.25oz~6oz)
Max aspect ratio:	1:10
Max board size:	400*700mm
Surface Finish:	HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material:	FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
PCB Assembly Capability
Stencil size range:	1560*450mm
Min SMT package:	0402/1005(1.0x0.5mm)
Min IC pitch:	0.3mm
Max PCB Size:	1200*400mm
Min PCB thickness:	0.35mm
Min Chip Size:	01005
Max BGA Size:	74*74mm
BGA Ball Pitch:	1.00~3.00mm
BGA Ball Diameter:	0.4~1.0mm
QFP Lead Pitch:	0.38~2.54mm
Testing :	ICT,AOI,X-RAY,Funtional test etc.