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IBE Fast EMS PCB Assembly Multilayer Printed Circuit Board Fabrication

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Contact name:Anna

IBE ELectronics Co.,LTD

IBE Fast EMS PCB Assembly Multilayer Printed Circuit Board Fabrication

Country/Region	china
Categories	Electronics Production Machinery

Product Details

Quick Delivery EMS PCB Assembly Service in Shenzhen,China

IBE is a professional PCB,SMT,PCB assembly, components sourcing and box build provider for global electronics manufacturing services(EMS).

Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.

We have a proven record of guiding manufacturers throughout the entire electronics manufacturing process. From simple designs to complex system integration, IBE provides the end-to-end electronics manufacturing services necessary to compete in a global marketplace.

Production capability:

Our PCB production capacity is up to 180,000 square meters a month.

We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.

IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.

We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.

IBE sticks to the rigorous quality management,procedure control and sets up 100% complete AOI inspection.

To shorten the clients' product cycle time to market,IBE Group invested in modernized equipment,such as automatic multi-layered PCB production equipment,high speed chip mounters and online SPI machines.

We also provide technical support for our customer on analysis of design for manufacturability,product fault judgment,PCB layout components selection and component replacement evaluation,etc.

IBE has own R&D center with 30 engineers,they are experienced in software programming,circuit design and mechanical structure design.

1	Material	PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2	Board Thickness	Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3	Surface Finish	HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4	PCB Panel Size	Max Mass Productoin: 610x460mm Sample:762x508mm
5	Layer	Mass production:2-58 Layers, Samples:1-64 Layers
6	Min. Drill Hole Size	Laser Drill 0.1mm,Machine Drill 0.2mm
7	PCBA QC	X-ray,AOI Test,Functional Test
8	Speciality	Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9	Sanforized	Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control