WUXI WANLI ADHESION MATERIALS CO., LTD. |
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Manufactory Direct Book Cover Binding Bulk Translucent Chips EVA Hot Melt WANLI® C-23 with Viscosity 4500±500mpa·s (160℃) for Book Cover Bonding with Paper Weight ≤300G/m²
Wanli® EVA hot melt adhesive C-23 for book cover bonding is a
ethylene-vinyl acetate copolymer with 100% solid content. C-23 is specifically developed for book wireless binding. C-23 is featured perfect bonding strength, fast curing, suitable
for automatic hot melt glue binding book production line.
APPLICATION
Wanli® EVA hot melt adhesive C-23 is used for book cover wireless
bonding. C-23 is suitable for paper with a weight of ≤300G/m².
Application Material | Book Cover Binding Adhesives |
Appearance | Transparent Flaky Solid |
Component | EVA |
Application Industry | Book Cover Binding Adhesives |
Solid Content | 100% |
Operating Temperature | 150~160 ℃( Depended On Equipment, Substrate, Environment And Other Conditions) |
Softening Temperature | 75±5 ℃ |
Melt Viscosity | 4500±500mpa·s (160℃) |
Usage Scope | For Paper With A Weight Of ≤300G/m² |
Shelf Life | 2 Years |
Package | 25Kg/Bag |
FEATURE
Perfect bonding strength.
Fast curing.
Suitable for automatic hot melt glue binding book production line.
USER GUIDE
The package of Wanli® EVA hot melt adhesive C-23 is suitable for various dispensing
equipment.
The recommended operating temperature is 150~160℃, which depends on
the equipment, substrate and environment and other conditions.
STORAGE
Cool, avoid direct sunlight, dry and not more than 35℃.