Shenzhen Sky-Win Technology Co., Ltd |
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Our client, hailing from the bustling network communications sector, sought a seasoned partner to assemble their sophisticated printed circuit board (PCB). The project demanded precision and a high level of expertise.
Our approach encompassed leading-edge automated machinery as well
as meticulous manual insertion methods to place each component on
the PCB. With a blend of modern auto-insertion equipment and
dexterous hand insertion techniques, we tackled the challenge of
assembling the board. The process didn't end there, as hand
soldering was brought into play using lead-free solder to ensure
not only quality but also environmental responsibility.
The PCB itself was crafted from high-grade FR4 material. This board
was not a trivial undertaking, with a total of 729 components
meticulously positioned using both surface mount and thru-hole
technologies. Designed to support complex functionality, the board
featured a multilayered structure with 8 distinct layers.
Precision was paramount, with components such as LGA, BGA, and QFN packages requiring fine pitch spacing. The board boasted a package size range starting from 0603, catering to the varying size requirements specified for different components.
To ensure compliance with the utmost standards, our quality assurance measures were stringent. The board underwent automated optical inspections alongside comprehensive functionality tests—each phase designed to uphold the standard of excellence our client expected.
Despite the intricate nature and rigorous quality expectations, the project was completed within an efficient turnaround time-frame of just 4 to 6 weeks.
In the realm of communication technology, printed circuit boards
(PCBs) are the backbone, with multilayer High-density Interconnect
(HDI) boards being pivotal for advanced communications products.
The introduction of 5G technology marks a new chapter in the
telecommunications industry, emphasizing the necessity for PCBs
that are not only stable and flexible but also simple to
manufacture and assemble. These attributes have become exceedingly
crucial to accommodate the complex requirements of the 5G
infrastructure.
Skywin rises to the challenge, offering expedited PCB manufacturing
and assembly tailored to a vast array of communication devices. Our
services encompass equipment essential for 5G base stations,
various wireless devices, and sophisticated digital terminal
products. We pride ourselves on our exemplary workmanship,
particularly demonstrated in the 5G smartphones we have crafted for
our clientele.
The excellence of these phones stems from their construction with
premium Class-A substrates, the utilization of 100% genuine
components, and steadfast adherence to RoHS & REACH
environmental standards. This attention to quality has facilitated
swift approvals during inspections conducted by local market
operators. The result is impressive—a rapid surge in the sales of
our products, a testament to the caliber of Skywin's PCB
manufacturing and assembly for the 5G communication sector.
Category | Communications PCB Assembly |
PCB Material | FR-4 |
PCB Thickness | 1.2mm |
Copper Thickness | 2OZ |
Specialist | High TG |
PCB Surface treatment | Immersion Gold |
Solder Mask | Black |
Silkscreen | White |
Quality Standard | IPC Class 2, 100% E-testing |
Additional Process | Protective Coating |
PCB quality system | ROHS/UL |
Application Segment | E-paper book/4G Communication/Network Switch |
Request File | PCB: Gerber files(CAM, PCB, PCBDOC) Components: Bill of Materials(BOM list) |
Wireless communication technology has become increasingly important
in our lives, providing us with connectivity and convenience while
we are on the move. PCB assembly is essential in enabling a variety
of wireless communication modules, such as Wi-Fi, Bluetooth, NFC,
and 5G, to work at required data rates and low latency.
The proliferation of the Internet of Things (IoT) has seen smart
devices gain widespread adoption. To enable them to effectively
collect, process, and transmit data, PCB assembly is used for
flawless communication and efficient functioning. This technique is
used in areas such as smart homes, wearable gadget technology, and
industrial IoT applications.
The Communication Printed Circuit Board Assembly from Sky-Win
Technology is especially suitable for environments that demand
robust digital communication capabilities. Whether it's for a
network switch or a 4G communication module, the Sky-Win PCB
assembly assures steadfast performance in digital data transmission
and processing. With a minimum order quantity of just 10 units and
negotiable pricing, this offering becomes accessible to both
small-scale and large-scale operations.
Practical scenarios for the use of the Sky-Win Technology PCB
assembly include telecommunications infrastructure, network
servers, satellite communication systems, and advanced computing
hardware. The product thrives in situations where the integrity of
the signal and uninterrupted service is non-negotiable. The Digital
Communication PCB Production by Sky-Win Technology, therefore,
becomes a cornerstone in applications ranging from data centers to
user-end communication devices that hinge on high-speed data
transfer and connectivity.
In summary, the Sky-Win Technology is the go-to solution for
any entity looking for a reliable partner in Communication PCB
Assembly, whether for prototyping or mass production. Its high
quality, adaptability to various scenarios, and commitment to
customer satisfaction through flexible payment and delivery options
make it a competitive product in the global market of Network PCB
Assembly Service.