Home Companies Witgain Technology Limited

Red Solder MultiLayer Circuit Board UL 6 Layer Printed Circuit Board 0.3MM Hole

Witgain Technology Limited
Active Member

Contact Us

[China] country

Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

Contact name:Steven YU

Inquir Now

Witgain Technology Limited

Red Solder MultiLayer Circuit Board UL 6 Layer Printed Circuit Board 0.3MM Hole

Country/Region china
City & Province shenzhen
InquireNow

Product Details

Multi Layer Circuit Board 6 Layer Printed Circuit Board Red Solder Mask

 

 

PCB Specifications:

 

1 Part NO: Multi-Layer PCB0027

2 Layer Count: 6 Layer  PCB

3 Finished Board Thickness: 1.6MM

4 Copper Thickness: 1/1/1/1 OZ

5 Min Lind Space&Width: 4.5/4.5 mil

6 Application Area: Medical Equitepments

 

 

 


Material Data Sheet:

 

S1130
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC135
TdIPC-TM-650 2.4.24.65% wt. loss310
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
After Tgppm/℃310
50-260℃%4.5
T260IPC-TM-650 2.4.24.1TMAmin13
T288IPC-TM-650 2.4.24.1TMAmin<1
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm4.8E + 08
E-24/125MΩ.cm4.6E + 06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.2E + 07
E-24/1255.3E + 06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
Electrical StrengthIPC-TM-650 2.5.6.2D-48/50+D-4/23kV/mm
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
IEC 61189-2-72110GHz--
Peel Strength(1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.8
125℃N/mm1.6
Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
CWIPC-TM-650 2.4.4AMPa500
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
CTIIEC30112C-48/23/50,PLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

 

 

Our Equipment List:

 

 

NOEquipment NameEquipment BrandEquipment QTY
1Automatic CuttingSCHCLLING-CA68581
2Roll CuttingQIXIAN2
3Vertical CuttingSHANGYUE2
4Innerlayer pretreatmentJIECHI4
5Automatic coat&wiringQUNYU4
6Automatic exposureCHUANBAO11
7Large table exposureHECHUAN2
8Laser PlotterORBOTEC3
9Etching lineKB4
10PE PunchingPE-30001
11AOIORBOTEC10
12Double row brownKB3
13PP CuttingZHENGYE5
14PP ChoppingZHONGDA2
15Hot-melt machineHANSONG6
16Riveting machineJIAOSHI6
17X-Ray CheckHAOSHUO5
18Automatic refluxLANDE2
19Steel plate washerFENGKAI2
20Large size pressDATIAN8热4冷
21X-Ray Drilling targetHAOSHUO8
22Ccd Drilling targetXUELONG10
23Automatic grindingXINHAO5
24Plate thickness MeasuringAISIDA2
25Four axis gongs machineDALIANG2
26Two axis gongs machineBIAOTEFU4
27Automatic grinding millJIEHUI2
28Drilling machineTONGTAI13
29Hole testing machineYAYA1
30Sinking rough millKB1
31Vertical copper wireYAMEI1
32Automatic electroplating lineJINMING1
33Dryer after electroplatingKB1
34Etch machineKB1
35Film checking machineYUBOLIN2
36Line pre-processingKB2
37Automatic laminatorZHISHENG3
38Outer exposure machineCHUANBAO8
39Outer exposure machineHECHUAN3
40Etch machineJULONG1
41Line developing machineKB1
42Sand blasting machineKB1
43Precoarsening pretreatmentKB2
44Electrostatic spraying lineFURNACE1
45Automatic screen printing machineHENGDAYOUCHUANG12
46Pre baked tunnel furnaceKB1
47Solder resist exposure machineCHUANBAO6
48Solder resist exposure machineHECHUAN2
49Post baked tunnel furnaceGC0-77BD2
50Solder resist developing machineKB1
51Screen printing machine1.8mm/2.0mm4
52Character baking tunnel furnaceGC0-77BD1
53Sunk Tin spray line 2
54Nickel palladium and gold wireXINHUAMEI1
55Alternator 2
56OSP lineKB1
57Gongs machineYIHUI20
58V-CUTZHENGZHI1
59CNC V-CUT machineCHENGZHONG2
60Hydraulic punch pressSRT2
61Test machineMASON17
62High speed flying needle testerWEIZHENGTAI3
63Four wire flying needle testerXIELI2
64Product washing machineKB2
65Plate warping machineXINLONGHUI2
66Vacuum packaging machineSHENGYOU4

 

 

 

Hot Products

Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment PCB Specifications: 1 ...
Video Conference Device Used Pcb 1.2mm Matte Black Solder Mask PCB Specifications: 1 Part NO: ...
Multi Layer Circuit Board 4 Layer Printed Circuit Board Blue Solder Mask PCB Specifications: 1 Part ...
Multilayer Circuit Board 8 Layer PCB Immersion Gold Main Features: Part NO: Multi-Layer PCB0005 ...
Multi Layer Circuit Board 6 Layer Printed Circuit Board Red Solder Mask PCB Specifications: 1 Part ...
Multilayer Circuit Board 12 Layer PCB FR4 Material Hight TG Immserion Gold Main Features: Part NO: ...