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4 Layer HDI PCB 0.8 MM Thickness Glass Epoxy FR4 PCB 3.5MIL

Witgain Technology Limited
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Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

Contact name:Steven YU

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Witgain Technology Limited

4 Layer HDI PCB 0.8 MM Thickness Glass Epoxy FR4 PCB 3.5MIL

Country/Region china
City & Province shenzhen
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Product Details

4 Layer HDI PCB 0.8 MM Thickness Epoxy Filled In Vias
 
 
Main Features:
 
1 4 Layer HDI PCB with blind and buried holes.
2 Green solder mask and immersion gold treatment.
3 Min hole size is 0.1mm and min BGA size is 7.1 mil.
4 Finished board thickness is 0.8 mm.
5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.
6 Drilling: L1-L2 0.15MM, L1-L3 0.15MM, L1-L4 0.15MM
7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in vias
8 PCB Size: 97.5*91.2/54pcs
 
 

X-OUT per panel:

 

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%


 
 
Our Capabilities:

 

NOItemCapability
1Layer Count1-24 Layers
2Board Thickness0.1mm-6.0mm
3Finished Board Max Size700mm*800mm
4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
5Warp<0.7%
6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8Drill Hole Diameter0.1mm-6.5mm
9Out Layer Copper Thickness1/2OZ-8OZ
10Inner Layer Copper Thickness1/3OZ-6OZ
11Aspect Ratio10:1
12PTH Hole Tolerance+/-3mil
13NPTH Hole Tolerance+/-1mil
14Copper Thickness of PTH Wall>10mil(25um)
15Line Width And Space2/2mil
16Min Solder Mask Bridge2.5mil
17Solder Mask Alignment Tolerance+/-2mil
18Dimension Tolerance+/-4mil
19Max Gold Thickness200u'(0.2mil)
20Thermal Shock288, 10s, 3 times
21Impedance Control+/-10%
22Test CapabilityPAD Size min 0.1mm
23Min BGA7mil
24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc

 
 
 
FAQ:
 
Q1: What is Surface Mount PCB Assembly?
A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.

Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.
 
 
 

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