Active Member
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[China]
Address: Room 1803, Middle Block,Fujing Building, Fuzhong Road, Futian district, Shenzhen China 518016 New website: https://www.tongzhanpcba.com/
Contact name:NICK CHENG
TONGZHAN INDUSTRIAL LIMITED |
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Conformal Coating Printed Circuit Board Fabrication High Multilayer
Printed Circuit Board Fabrication Description:
1. Quick-turn and flexible delivery.
2. Support a wide range of PCBs: high-layer, multi-layer,
rigid-flex, high frequency, high speed, etc.
3. Professional supplier positioning.
4. Seamless link from prototype to mass production.
5. Whole-flow quality assurance, IPC, Special industry inspection
standard.
Printed Circuit Board Fabrication Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Printed Circuit Board Fabrication Introduction:
The earliest use of printed circuit boards is paper-based
copper-clad printed boards. Since the advent of semiconductor
transistors in the 1950s, the demand for printed boards has risen
sharply. Especially with the rapid development and wide application
of integrated circuits, the volume of electronic equipment is
getting smaller and smaller, and the circuit wiring density and
difficulty are getting bigger and bigger, which requires the
printed board to be updated continuously. At present, the variety
of printed boards has developed from single-sided to double-sided,
multi-layer boards and flexible boards; the structure and quality
have also developed to ultra-high density, miniaturization, and
high reliability.
