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OEM Electronic Pcb Assembly Prototype ROHS PCBA Manufacturing Fabrication

Huaswin Electronics Co.,Limited
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Contact name:Vicky Lee

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Huaswin Electronics Co.,Limited

OEM Electronic Pcb Assembly Prototype ROHS PCBA Manufacturing Fabrication

Country/Region china
Categories Wiring Harness
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Product Details

 
Electronic OEM PCBA Service/ Prototype PCB Assembly Services ROHS PCB Fabrication

 

 

PCB Assemlby services including:  

 

* Electronic Design Engineering
* PCB Design and Layout
* Complete PCB Fabrication
* Custom & High Temp materials
* BGA/LGA, Blind/Buried Vias, Controlled Impedance, Differential Pairs
* Production and Inventory Control
* Turn-key Parts Procurement, Assembly 
* Testing & Packaging Services
* Quality Electronic/Electro-Mechanical Assembly.
* ESD Safety
* Process Routing - Specific for each job
* ROHS Compliance 

* Complete Document Control:
- Engineering Change Order
- Serialization of Assemblies & Cables for Tracking
- Modification Procedure
- Revision Control/Prints
- Deviation Forms

* Surface Mount Technology
* Mixed Technology Board Assemblies
* Rework & Handwiring

 

 

Detailed Specification of PCB Manufacturing

 

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, 

Polyimide, 

Aluminum-based

 material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ 

Silver/Tin,

 Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

 

 

 

Detailed Specification of Pcb Assembly

 

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials 

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days 

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test

 
 

 

Quality Assurance: 
 
Our Quality processes include: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008

 

 

Factory view: 

 

 

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