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High Precision PCB Fabrication Blind Buried PCB ENIG Circuit Board

Huaswin Electronics Co.,Limited
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Contact name:Vicky Lee

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Huaswin Electronics Co.,Limited

High Precision PCB Fabrication Blind Buried PCB ENIG Circuit Board

Country/Region china
Categories Electronics Production Machinery
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Product Details

 

High Precision Turnkey PCB Assembly Service with Blind/Buried PCB ENIG circuit board

 

 

Welcome to Huaswin!

 

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP

assembly ,IC pre-programming / burning on-line, testing, packing.

 

 

PCB capability and services: 


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test


 

PCB Assembly services: 

 

 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection

 


Through-hole Assembly 


Wave Soldering 
Hand Assembly and Soldering

Material Sourcing 
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

 

 

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

 When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

 

Testing Methods

AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

 

 

ISO Certification:
Huaswin’s production facility is ISO9001 certified to ensure top quality production of your product!

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