Shenzhen Betterliv Technology Co., Ltd. |
|
Fast Custom 6 Layers HDI Buried Blind Vias Hole PCB Quick Turn PCB Assembly For Eelectrical Products
PCB Manufacture Capability
Layers | 6 Layers |
Material | FR4 TG130 |
Copper thichness | 1oz |
Board thickness | 1.6mm |
Min. Hole Size | 0.3mm |
Min. Line Width | 8mil |
Min. Line Spacing | 8mil |
Surface Finish | ENIG |
S/M Color | Blue |
Special Process | HDI, BVH, back drill, pressfit hole, edge plating, VOP, counter
sunk, half hole, gold plating, gold finger, ENIG+OSP, flex board,
rigid-flex board |
Our service
We are manufacturer, specializing in PCB and PCBA R&D and production.
• Electronic components material purchasing
• Bare PCB fabrication
• PCB Assembly Service. (SMT, DIP)
• FULL Test: AOI, X-Ray, In-Circuit Test (ICT), Functional Test
(FCT)
• Conformal coating service
• Prototyping and mass production...
• PCB layout, PCBA design according to your idea