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16layer prototype fabrication Multilayer Pcb Assembly For Video Surveillance

Beijing Haina Lean Technology Co., Ltd
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Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing

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Beijing Haina Lean Technology Co., Ltd

16layer prototype fabrication Multilayer Pcb Assembly For Video Surveillance

Country/Region china
City & Province beijing beijing
Categories Mobile Phone Chargers
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Product Details

Fr4 Multilayer Electronics Components PCB Assembly for video surveillance

 

Multilayer PCB Assembly Introduction

 

Multilayer PCB Assembly can save your money, have shorter lead time, and is of high-quality products. Our assemblers, preparing the PCB boards, procure raw materials & components, finishing quality testing & inspection, assembly it ready for delivery finally.

Our professional team are experienced in handling this delicate process, aiming to build multifunctional assemblies that serve all your purposes with space limitations to meet your needs.

 

Multilayer Circuit Board Assembly Capabilities
 
FACTORY CAPABILITIES
No.Items2020
1HDI CapabilitiesHDI ELIC(5+2+5)
2Max layer count46L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.05mm
Mechnical 0.15
5Min Line Width/Space0.030mm/0.030mm
6Copper Thickness1/3oz-6oz
7Size Max Panel size700x610mm
8Registration Accuracy+/-0.05mm
9Routing Accuracy+/-0.05mm
10Min.BGA PAD0.125mm
11Max Aspect Ratio10:01
12Bow and Twist0.50%
13Impedance Control Tolerance+/-5%
14Daily output4,000m2 (Max capacity of equipment)
15Surface FinishingHASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
PCBA Capability
Material TypeItemMinMax
PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
ComponentsChip&IC100555mm
BGA Pitch0.3mm-
QFP Pitch0.3mm-
 

SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology.

These solutions include:

7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines

 

DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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Multilayer PCB Assembly Process

 

1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

Delivery Time 

 

Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD
 

Workshop

 

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

 

 

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