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TG180 High Speed Pcb Board Material FR4 Fpga Circuit Board Design 1.6mm

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Address: Building B, Shangxing West Industrial Zone, No. 1001, West Ring Road, Shajing street, Bao'an District, Shenzhen, Guangdong, China

Contact name:Yu

Quanhong FASTPCB

TG180 High Speed Pcb Board Material FR4 Fpga Circuit Board Design 1.6mm

Country/Region	china
City & Province	shenzhen guangdong
Categories	Switching Power Supply

Product Details

FR-4 TG180 FPGA High Speed Printed Circuit Board

The FR-4 TG180 FPGA High Speed Printed Circuit Board is a high-speed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made by pure pressing of FR-4 TG180 high-speed materials, surface gold deposition and other production processes. It is widely used in the field of high-speed computers and high-end servers in cloud data centers. The products have the characteristics of stability and durability.

Item		HDI Advanced Technology
Item		2019	2020	2021
Structure		5+n+5	6+n+6	7+n+7
HDI Stack Via		AnyLayer(12L)	AnyLayer(14L)	AnyLayer(16L)
Board Thickness(mm)	Min. 8L	0.45	0.4	0.35
	Min. 10L	0.55	0.45	0.4
	Min. 12L	0.65	0.6	0.55
	MAX.		2.4
Min. Core Thickness ( um )		50	40	40
Min. PP Thickness ( um )		30(#1027PP)	25(#1017PP)	20(#1010PP)
Base Copper Thickness	Inner Layer ( OZ)	1/3 ~ 2	1/3 ~ 2	1/3 ~ 2
Base Copper Thickness	Outer Layer ( OZ )	1/3 ~ 1	1/3 ~ 1	1/3 ~ 1
Item		HDI Advanced Technology
Item		2019	2020	2021
Min. Mechanical Drill hole size(um) **		200	200	150
Max. Through Hole Aspect Ratio *		8:1	10:1	10:1
Min. Laser via/Pad Size ( um )		75/200	70/170	60/150
Max. Laser Via Aspect Ratio		0.8:1	0.8:1	0.8:1
Laser Via on PTH(VOP)design		Yes	Yes	Yes
Laser X type through hole(DT≤200um)		NA	60~100um	60~100um
Min. LW/S (L/S/Cu, um)	Inner Layer	45 /45 /15	40/ 40/ 15	30/ 30 /15
Min. LW/S (L/S/Cu, um)	outer Layer	50 /50/ 20	40 /50 /20	40 /40 /17
Min BGA Pitch (mm)		0.35	0.3	0.3
Item		HDI Advanced Technology
Item		2019	2020	2021
Solder mask Registration (um)		+/- 30	+/- 25	+/- 20
Min. Solder Mask Dam (mm)		0.07	0.06	0.05
PCB Warpage Control	>= 50ohm	+/-10%	+/-8%	+/- 5%
PCB Warpage Control	< 50ohm	+/- 5ohm	+/- 3ohm	+/- 3ohm
PCB Warpage Control		≤0.5%	≤0.5%	≤0.5%
cavity Depth accuracy (um)	Mechanical	+/- 75	+/- 75	+/- 50
cavity Depth accuracy (um)	Laser directly	+/- 50	+/- 50	+/- 50
Surface Finishing		OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag	OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

Item		HLC Advanced Technology
Item		2019	2020	2021
Max Panel Width (inch)		25	25	25
Max Panel Length (inch)		29	29	29
Max Layer Count (L)		16	18	36
Max Board thickness (mm)		3.2	4	6
Max Board thickness Tolerance		+/-10%	+/-10%	+/-10%
Base copper Thickness	Inner layer ( OZ )	4	6	8
Base copper Thickness	Outer Layer ( OZ )	2	3	4
Min DHS ( mm )		0.2	0.15	0.15
PTH Size Tolerance ( mil )		+/-2	+/-2	+/-2
Back Drill (stub)( mil )		~ 3	~ 2.4	~ 2
Max. AR		12:1	16:1	20:1
Item		HLC Advanced Technology
Item		2019	2020	2021
M-drill tolerance	Inner layer ( mil )	DHS + 10	DHS + 10	DHS + 8
M-drill tolerance	Outer Layer ( mil )	DHS + 8	DHS + 8	DHS + 6
Solder mask Registration (um)		+/- 40	+/- 30	+/- 25
Impedance control	≥50ohms	+/-10%	+/-10%	-/-8%
Impedance control	<50ohms	5 Ω	5 Ω	4 Ω
Min LW/S (Inner)@1oz base Cu ( mil )		3.0 / 3.0	2.6 / 2.6	2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil )		3.5 / 3.5	3.0 / 3.5	3.0 / 3.0
Max dimple for POFV ( um )		30	20	15
Surface Finishing		ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

Item		SMT Capability
Item		2019	2020	2021
Min board thickness ( mm )		0.1	0.06	0.05
Max. board size ( mm )		200 x 250	250 x 300	250 x 350
Chip component ( L, C, R etc. )	Minimum size	1005	1005	1005
Connector	0.5 mm pitch	Y	Y	Y
	0.4 mm pitch	Y	Y	Y
	0.35 mm pitch	Y	Y	Y
High density component :	0.5 mm pitch	Y	Y	Y
TSOP, QFP, QFN, LGA, BGA etc.	0.4 mm pitch	Y	Y	Y
	0.35 mm pitch	Y	Y	Y
Reflow	N2 reflow	No	Y	Y
Under-fill	Fill under chip	Manual	Auto	Auto
ACF attach	Gold finger pitch	N/A	0.3 mm	0.2 mm
Inspection	Component position, direction, missing etc.	Manual check with 10 x scope	Auto AOI inspection	Auto AOI inspection
Inspection	Solder paste thickness	Measure once per shift	1 line auto full area, online SPI	All lines auto full area, online SPI

Packaging & Delivery
Packaging Details:	Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement.
Port:	Shenzhen or Hongkong
Lead Time:	Quantity(Pieces)	1-10	11-100	101-1000	>1000
	Est. Time(days)	3-5	3-5	7-9	To be negotiated

FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China