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PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

YUSH Electronic Technology Co.,Ltd

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PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

Country/Region china
City & Province suzhou jiangsu
Categories Electronics Production Machinery
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Product Details

Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards

  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

 

Laser Depanelizer Machine,YSATM-3L Feature:

1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3. Reduce energy consumption, Cost savings.

4. Cost-effective, fast cutting speed, stable performance

 

Laser Depanelizer Machine, YSATM-3L Specification:

 

Parameter

 

 

 

 

 

 

 

 

Technical parameters

Main body of laser1480mm*1360mm*1412 mm
Weight of the1500Kg
PowerAC220 V
Laser355 nm
Laser

 

Optowave 10W(US)

Material≤1.2 mm
Precisio±20 μm
Platfor±2 μm
Platform±2 μm
Working area600*450 mm
Maximum3 KW
VibratingCTI(US)
PowerAC220 V
Diameter20±5 μm
Ambient20±2 ℃
Ambient<60 %
The MachineMarble

Laser Depanelizer Machine Principle

 

 

 

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