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Immersion Silver Metal Core PCB SMT Printed Circuit Board Assembly

Shenzhen Found Printed Circuit Board Co., Ltd.
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Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen

Contact name:Frank

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Shenzhen Found Printed Circuit Board Co., Ltd.

Immersion Silver Metal Core PCB SMT Printed Circuit Board Assembly

Country/Region china
City & Province shenzhen guangdong
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Product Details

Immersion Silver Metal Core PCB SMT Printed Circuit Board Assembly

 

1. Product Features And Advantages:

  • The dielectric constant (DK) is low and stable, so the signal transmission is good without delay.
  • The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal transmission of the whole equipment excellent.
  • Delamination of copper foil will not be caused by the change of cold and heat due to the consistency with the thermal expansion coefficient of copper foil.
  • Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
  • UL, ISO certified PCB manufacturing factory.
  • Make delivery on time keeping 98% on-time-delivery rate.
  • Eligible products rate of first production: >95%
  • Experienced sales persons provide skilled customer services.
  • Fast and flexible to save the time of production from prototype to standard production

2. Product Specification:

PCB Manufacture Capability
ItemManufacture Capability
Layers1-26 Layers
HDI2+N+2
Material TypesFr-4,Fr-5,High-Tg,Aluminum Based , Halogen Free,
Isola,Taconic,Arlon,Teflon,Rogers,
Max.Panel Dimension39000mil * 47000mil (1000mm * 1200mm)
Outline Tolerance± 4mil (± 0.10mm)
Board Thickness8mil-236mil (0.2 - 6.0mm)
Board Thickness Tolerance± 10%
Dielectric Thickness3mil-8mil ( 0.075mm-0.20mm)
Min.Track Width3mil ( 0.075mm )
Min.Track Space3mil ( 0.075mm )
External Cu Thickness0.5 OZ - 10 OZ ( 17um - 350um)
Internal Cu Thickness0.5OZ - 6OZ ( 17um - 210um)
Drilling Bit Size ( CNC )6mil-256mil ( 0.15mm - 6.50mm)
Finished Hole Dimension4mil-236mil(0.1mm - 6.0mm)
Hole Tolerance± 2mil (± 0.05mm)
Laser Drilling Hole Size4mil(0.1mm)
Aspect Ration16: 1
Solder MaskGreen,Blue,White,Black,Red,Yellow,Purple,etc.
Min Solder mask Bridge2mil(0.050mm)
Plugged Hole Diameter8mil-20mil ( 0.20mm-0.50mm)
Beveling30o - 45o
V-scoring+/-0.1mm,15o30o45o60o
Impedance ControlMin. 5%General10%
Surface FinishingHASL,HASL(lead Free),Immersion Gold
Immersion Silver,OSP,Hard Gold ( up to 100u" )
CertificationUL RoHS ISO9001: 2000 ISO14000: 2004 SGS
Quality StandardsAccept spcifications of customer and IPC(class II or III)

 

 

3. Product Show:

 

 

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