Active Member
|
[China]
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
Contact name:Frank
Shenzhen Found Printed Circuit Board Co., Ltd. |
|
|
Port: | Shenzhen,China |
Production Capacity: | 10000 Piece/Pieces Per Week |
Payment Terms: | L/C, T/T, D/P, Paypal |
Structure: | Gold Finger |
Dielectric: | FR-4 |
Material: | Fr4,Aluminum,High Tg Fr4 |
Application: | Medical Instruments |
Processing Technology: | Gold Finger |
Base Material: | Fr4,Aluminum,High Tg Fr4 |
PCB product Capacity:
| PCB assembly Layers | 1 Layers to 20 layer (standard, including HDI board ) |
| PCB assembly material/type | FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
| PCB Assembly service type | DIP/SMD or Mixed SMD & DIP |
| Base material thickness | 0.2-3.6mm |
| Copper thickness | 18um(H/HOZ),35um(1/1OZ),70um(2/2OZ),5OZ |
| Assembly surface finish | Gold-plated, HASL,OSP, ENIG |
| PCB Dimension (max) | 500*700mm |
| IC Pitch(min) | 0.2mm |
| Chip size(min) | 01005 |
| Drilled hole size(min) | 0.075mm |
| Track width/spacing(min) | 3mil |
| IC Encapsulation type | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
| Outline tolerance | ±0.1mm |
| Hole diameter tolerance | ±0.076mm |
| Hole location tolerance | ±0.076mm |
| V-CUT tolerance | ±0.1mm |
| Warp | according to the IPC-600F standard |
| Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
| Sample lead time | Single side:2-3 working days, Double-side:3-4 working days, Multi-layer:8-10 working days |
| Technology | |||
| Min trace/space(inner/external) | 3/3 mil0.075/0.075mm | ||
| Min drill size for through hole | drill 8.0 mil0.20mm | ||
| Laser dill | 4 mil0.1mm | ||
| Copper Foil Thickness | 17-210um | ||
| Inner Core Thickness | ±0.08mm | ||
| Tolerance of total board thickness | ±0.015mm | ||
| Max .Unit Area | 700-800 | ||
| Min. Unit Area | 2-5mm | ||
| Max Layer | 1-18 Layers | ||
| Surface Treatment | |||
| Solder Coating Thickness Sn | 4-20um | ||
| Cobalt/ Gold plating, Hard Gold Thickness | Ni:5-10umAu:0.05-0.20um | ||
| Gold/Nickel Plating Thickness | Ni:5-10umAu:0.05-0.15um | ||
| OSP Coating Thickness | 0.2-0.5um | ||
| Electroness Au Thickness | Ni:3-15umAu:0.025-0.10mm | ||
| Chem .Tin Thickness | Sn:0.8-5um | ||
| Producting Capacity | each day :800-100m2 | ||
| Aspect Ratio | 6:01:00 | ||
| Hole Registration | 0.004" (0.1mm) |
Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days,
above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Rogers 4350B PCB Rogers 4003C PCB Hard Gold
Aluminum Pcb Metal Core Pcb
2 Layer PCB With Matt B
