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Copper Rigid Flex PCB Printing Service Taconic Rogers For Bluetooth Product

Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Contact name:Mank.Li

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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Copper Rigid Flex PCB Printing Service Taconic Rogers For Bluetooth Product

Country/Region china
City & Province hong kong hong kong
Categories Other Rubber Products
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Product Details

6 layers of two HDI, FR-4, TG180,Bluetooth product coefficient,Taconic pcb,Rogers pcb high,High tg pcb

 

Product Description

  1. Product area: Bluetooth product coefficient
  2. Number of layers: 6 layers of two HDI, FR-4, TG180, plate thickness 1.60mm, laser hole 0.1mm, resin hole filling + copper hole filling
  3. Impedance tolerance: ±10%
  4. Surface treatment: Shen Jin
  5. Test method: computer 100% E-Test
  6. Packing: vacuum packaging + desiccant + humidity card + carton
  7. Mode of transport: air, sea, motor, logistics, express

Surface treatment:
full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

 

 

One stop services

  1. PCB layout
  2. Electronic design
  3. Engineering
  4. PCB fabrication
  5. PCB Assembly
  6. Box Build
  7. IC Programming
  8. Testing
  9. Parts sourcing
  10. Supply management
  11. After sales servies et

PCB, FPC process production capability

TypeJiangxi ChaoshengZhejiang Kunyu
ScopeDouble Side,Multilayers(4-20)Multilayers(4-28),HDI(4-20)Flex,Rigid Flex
Double SideCEM-3, FR-4,Rogers RO4233,Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm)CEM-3, FR-4,Rogers RO4233,Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)
Multilayers4-20 layers, board thickness 15mil-126mil (0.38mm-3.2mm)4-28 layers, board thickness 8mil-126mil (0.2mm-3.2mm)
Buried/Blind Via4-18 layers, board thickness 15mil-126mil(0.38mm-3.2mm)4-20 layers, board thickness 10mil-126mil(0.25mm-3.2mm)
HDI/1+N+1,2+N+2,3+N+3,Anylayer
Flex & Rigid-Flex PCB/1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB
LaminateShengyi,EMC,ITEQ,Panasionic,Hitachi....
Soldermask Type(LPI)Taiyo,Goo’s,Probimer.....Taiyo,Goo’s,Probimer FPC.....
Peelable SoldermaskPeters
Carbon inkNipon
HASL/Lead Free HASLThickness: 0.5-40umThickness: 0.5-40um
OSPEntek Plus HT, Preflux F2 LX
ENIG (Ni-Au)Au:0.03um≤max<0.06um Ni:3um≤max≤6um
Electro-bondable Ni-AuAu:0.2-1.0um Ni:2.54-10um
Electro-nickel palladium Ni-Au Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm
Electro. Hard GoldAu:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)
Thick tin1.0-1.4um
CapabilityMass ProductionMass Production
Min Mechanical Drill Hole0.20mm0.20mm
Min. Laser Drill Hole/4mil (0.100mm)
Line Width/Spacing3mil/3mil2mil/2mil
Max. Panel Size18.5" X 24.5"(470mm X 622mm)21.5" X 24.5"(546mm X 622mm)
Line Width/Spacing Tolerance+/-10% ~ +/-20%Non electro coating:+/-5um,Electro coating:+/-10um
PTH Hole Tolerance+/-0.003inch(0.075mm)+/-0.002inch(0.050mm)
NPTH Hole Tolerance+/-0.002inch(0.050mm)+/-0.002inch(0.050mm)
Hole Location Tolerance+/-0.003inch(0.075mm)+/-0.002inch(0.050mm)
Hole to Edge Tolerance+/-0.004inch(0.100mm)+/-0.004inch(0.100mm)
Edge to Edge Tolerance+/-0.004inch(0.100mm)+/-0.004inch(0.100mm)
Layer to Layer Tolerance+/-0.004inch(0.100mm)+/-0.003inch(0.075mm)
Impedance Tolerance+/- 10%+/- 10%
Warpage %Max ≤0.75%Max≤0.5%

 

Technology (HDI Product)

ITEMProductionTighten Control
Laser Via Drill/Pad0.125/0.30 , 0.125/0.380.125/0.28 , 0.125/0.36 , 0.20/0.40
Blind Via Drill/Pad0.25/0.500.20/0.45
Line Width/Spacing0.10/0.100.075/0.075
Hole FormationCO2 Laser Direct Drill 
Build Up MaterialFR4 LDP(LDD); RCC 50 ~100 micron 
Cu Thickness on Hole WallBlind Hole: 10um(min)Buried Hole: 13um(min)
Aspect Ratio0.8 : 1 

 

Technology (Flexible PCB)

ProjectAbility
Roll to roll (one side)YES
Roll to roll (double)NO
Volume to roll material width mm250
Minimum production size mm250x250
Maximum production size mm500x500
SMT Assembly patch (Yes/No)YES
Air Gap capability (Yes/No)YES
Production of hard and soft binding plate(Yes/No)YES
Max layers(Hard)10
Tallest layer(Soft plate)6
Material Science
PIYES
PETYES
Electrolytic copperYES
Rolled Anneal Copper FoilYES
PI 
Covering film alignment tolerance mm±0.1
Minimum covering film mm0.175
Reinforcement
PIYES
FR-4YES
SUSYES
EMI SHIELDING
Silver InkYES
Silver FilmYES

 

 

NOsupplierSupply material nameMaterial origin
1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
4SanTiePI, covering membraneJapan
5Born goodFR-4,PI,PP,Copper berthshenzhen, China
6A rainbowPI, covering membrane,Copper berthTaiwan
7teflonHigh frequency materialsThe United States
8RogersHigh frequency materialsThe United States
9Nippon SteelPI, covering membrane,Copper berthTaiwan
10sanyoPI, covering membrane,Copper berthJapan
11South AsiaFR-4,PI,PP,Copper berthTaiwan
12doosanFR-4,PPSouth Korea
13Tai Yao plateFR-4,PP,Copper berthTaiwan
14AlightFR-4,PP,Copper berthTaiwan
15YaoguangFR-4,PP,Copper berthTaiwan
16YalongFR-4,PPThe United States
17ISOALFR-4,PPJapan
18OAKBuried, buried resistance, PPJapan
19United States 3MFR-4,PPThe United States
20BergsCopper and aluminum matrixJapan
21The suninkTaiwan
22MuratainkJapan
23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
24YasenPPI, covering membraneChina jiangsu
25Yong Sheng TaiinkChina guangdong panyu
26mitainkJapan
27Transcriptceramic materialTaiwan
28HOMEceramic materialJapan
29Fe-Ni-MnAlloy Invar, Section SteelTaiwan
30Yingtanopper and aluminum matrixChina's jiangxi

 

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

 

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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