MOKO TECHNOLOGY LTD |
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Brand Name: | OEM | Number of Layers: | 6-Layer | Base Material: | FR4/Copper base |
Copper Thickness: | 1 OZ | Board Thickness: | 1.6mm | Min. Hole Size: | 0.15mm |
Min. Line Width: | 0.075mm | Min. Line Spacing: | 0.075mm | Surface Finishing: | HASL |
10 years manufacturer experience
FR-4 material
specialized in pcb
China manufacture
Specification:
Lead free HASL PCB
-Lead free HASL Surface finish required to meet ROHS compliant
-FR4 material with 0.2mm-3.2mm boards thickness
-Copper weight:0.5OZ,1OZ,2OZ,3OZ
-4-4mils track width spacing
-0.2mm min finished hole size
-Certificate: UL, ROHS, T/S16949 -Company management: ISO9001:2000 -Markets: Europe, America, Asia
NO | ITEM | Technical capabilities |
1 | Layers | 1-30 layers |
2 | Max. Board size | 2000×610mm |
3 | Min. board Thickness | 2-layer 0.15mm |
4-layer 0.38mm | ||
6-layer 0.55mm | ||
8-layer 0.80mm | ||
10-layer 1.0mm | ||
4 | Min. line Width/Space | 0.075mm(3mil) |
5 | Max. Copper thickness | 6OZ |
6 | Min. S/M Pitch | 0.075mm(3mil) |
7 | Min. hole size | 0.1mm(4mil) |
8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Hole position deviation | ±0.05mm(2mil) |
11 | Outline tolerance | ±0.10mm(4mil) |
12 | Twist & Bent | 0.75% |
13 | Insulation Resistance | >1012 Ω Normal |
14 | Electric strength | >1.3kv/mm |
15 | S/M abrasion | >6H |
16 | Thermal stress | 288°C 20Sec |
17 | Test Voltage | 50-300V |
18 | Min. blind/buried via | 0.15mm (6mil) |
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |