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OSP HASL Lead Free Flex Pcb Manufacturing Custom Pcb Board Processing

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[China]

Address: FL.3-4,Blog.K,Jinchangda Tech Park,Guanlan St.,Longhua Dist.,Shenzhen,China

Contact name:Taylor Yang

Shenzhen Changkeshun Technology Co., Ltd.

OSP HASL Lead Free Flex Pcb Manufacturing Custom Pcb Board Processing

Country/Region	china
City & Province	shenzhen

Product Details

Flex Pcb Manufacturing Custom Pcb Board Pcb Processing

If desired, we will source, organise and manage all aspects of the PCB, so that your product meets all required standards and is fully optimised for easy and cost effective manufacturing. A well designed circuit board means: · A reduction in production problems · Improved quality control · Reduced costs · Reduced manufacturing times

We work to supply small and large batches of competitively priced printed circuit boards to our customers.

We provide following services for all of our customers:

1) PCB production service, available on FR-4, TG150-180, aluminum, FPC

2) PCBA copy service IC Decrepted ,Programming

3) PCB assembly service. Available on SMT, BGA, DIP,Stencil

4) Box-build assembly, available on final functional testing and final package

5) Electronic component purchasing service

6)Membrane Switch "Quality First, Customer Highest and Thoughtful Service" is the management principle that we always adhere to. Our working target is "to do our best to satisfy customers".

Our products have the best quality and reasonable prices. Our products sell well in South Asia, the Middle East, Europe, America, Australia, etc. We win recognition and support from more and more customers. We are looking forward to establishing long-term and cooperative relationships with customers to make glorious achievements. Please feel free to contact us for further information.

Product Description

Product Name	PCBA customize
Surface Finishing	Gold Plating
Certificate	ROHS. ISO9001.
Pcb board material	Fr4 / Aluminum / Cu
Copper Thickness	0.5-3OZ
Board Thickness	0.8-2.0mm
Testing Service	Fly-probe/AOI/100%function Testing
PCB layer	SMT DIP Electronic Board

FR-4 Process capability
NO	Item	Craft Ability
1	Surface Finish	HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2	Layer	1-32 layers
3	Min.Line Width	4mil
4	Min.Line Space	4mil
5	Min.Space between Pad to Pad	3mil
6	Min.Hole Diameter	0.20mm
7	Min.Bonding Pad Diameter	0.20mm
8	Max.Proportion of Drilling Hole and Board Thickness	1:10
9	Max.Size of Finish Board	23inch*35inch
10	Rang of Finish Board′s Thickness	0.21-3.2mm