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70um HASL HDI PCB Board 4 Layer 8mil PTEF Alu Cu With Blue Solder Mask

Abis Circuits Co., Ltd.
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Address: 4113-4116# A Area, HSST PARK, BAO'AN District, Shenzhen, China

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Abis Circuits Co., Ltd.

70um HASL HDI PCB Board 4 Layer 8mil PTEF Alu Cu With Blue Solder Mask

Country/Region china
City & Province shenzhen guangdong
Categories Other Welding & Soldering Supplies
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Product Details

       2 Oz High Density HDI PCB Board 4 Layer Printed Circuit Boards With Blue Solder Mask PCB Manufacturing

The 1.6mm HDI PCB Circuit Board is 4 Layers, and it was made with FR - 4 board material, with 2 Oz / 70µm copper thickness.

Also, the board size of this PCB Circuit Board is customized, with blue solder mask and HASL Lead Free surface treatment.

 

Detail Specifications

Layers4
MaterialFR-4
Board Thickness1.6mm
Copper Thickness2oz/70um
Surface Treatment

HASL Lead Free

Soldmask & SilkscreenBlue&White
Quality StandardIPC Class 2, 100% E-testing
CertificatesISO14001, ISO9001, UL, cUL, TS16949

 

 

 

 

 

 

 

 

 

PCB Capacity

Layers1~20
Board Thickness0.1mm-8.0mm
MaterialFR4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc
Max Panel Size600mm×1200mm
Min Hole Size0.1mm
Min Line Width/Space3mil(0.075mm)
Board Outline Tolerance0.10mm
Insulation Layer Thickness0.075mm--5.00mm
Out Layer Copper Thickness18um--350um
Drilling Hole (Mechanical)17um--175um
Finish Hole (Mechanical)0.10mm--6.30mm
Diameter Tolerance (Mechanical)0.05mm
Registration (Mechanical)0.075mm
Aspect Ratio16:01
Solder Mask TypeLPI
SMT Mini. Solder Mask Width0.075mm
Mini. Solder Mask Clearance0.05mm
Plug Hole Diameter0.25mm--0.60mm
Impedance Control Tolerance10%
Surface finishENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold
SoldermaskGreen/Yellow/Black/White/Red/Blue
SilkscreenRed/Yellow/Black/White
CertificateUL, ISO 9001, ISO14001, IATF16949
Special RequestBlind hole, Gold finger, BGA, Carbon ink, peelable mask, VIP process, Edge plating, Half holes
Material SuppliersShengyi, ITEQ, Taiyo, etc.
Common PackageVacuum+Carton

 

 

PCBA Capacity

Capacity 
Single and double-sided SMT/PTHYes
Large parts on both sides, BGA on both sidesYes
Smallest Chips size0201
Min BGA and Micro BGA pitch and ball counts0.008 in. (0.2mm) pitch, ball count greater than 1000
Min Leaded parts pitch0.008 in. (0.2 mm)
Max Parts size assembly by machine2.2 in. x 2.2 in. x 0.6 in.
Assembly surface mount connectorsYes
Odd form parts:Yes, Assembly by hands
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets
Reflow solderingYes
Max PCB size14.5 in. x 19.5 in.
Min PCB Thickness0.2
Fiducial MarksPreferred but not required
PCB Finish:1. SMOBC/HASL
2. Electrolytic gold
3. Electroless gold
4. Electroless silver
5. Immersion gold
6. Immersion tin
7. OSP
PCB ShapeAny
Panelized PCB1. Tab routed
2. Breakaway tabs
3. V-Scored
4. Routed+ V scored
Inspection1. X-ray analysis
2. Microscope to 20X
Rework1. BGA removal and replacement station
2. SMT IR rework station
3. Thru-hole rework station
FirmwareProvide programming firmware files,Firmware + software installation instructions
Function testLevel of testing required along with test instructions
PCB file:PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc)

 

Lead Time (Peak production time might deffer, please RFQ)

 
CategoryQ/T Lead timeStandard Lead TimeMass Production
 
2 Layers24hrs3-4 working days8-15 working days
 
4 Layers48hrs3-5 working days10-15 working days
 
6 Layers72hrs3-6 working days10-15 working days
 
8 Layers96hrs3-7 working days14-18 working days
 
10 Layers120hrs3-8 working days14-18 working days
 
12 Layers120hrs3-9 working days20-26 working days
 
14 Layers144hrs3-10 working days20-26 working days
 
16-20 LayersDepends on the specific requirements
 
20+ LayersDepends on the specific requirements
 

 

 

Normal Lead Time
CategoryQ/T Lead timeStandard Lead TimeMass Production
 
2 Layers24hrs3-4 working days8-15 working days
 
4 Layers48hrs3-5 working days10-15 working days
 
6 Layers72hrs3-6 working days10-15 working days
 
8 Layers96hrs3-7 working days14-18 working days
 
10 Layers120hrs3-8 working days14-18 working days
 
12 Layers120hrs3-9 working days20-26 working days
 
14 Layers144hrs3-10 working days20-26 working days
 
16-20 LayersDepends on the specific requirements
 
20+ LayersDepends on the specific requirements
 

 

About us

 

ABIS Circuits Co., Ltd established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters.

 

Factory:

Operation plant space: (I) 10000 Square meters
                                     (II) 60000 Square meters
Employees: (I) 300 Man Powers
                    (II) 900 Man Powers
Eng. Technical: (I) 20 QA QC Engineers
                          (II) 60 QA,QC Engineers

 

What ABIS Circuit can do for you:

 

PCB manufacturing (prototype, small to medium, mass production)

  • Components Sourcing
  • PCB Assembly/SMT/DIP

 

Quotation of ABIS

To ensure an accurate quote, be sure to include the following information for your project:

  • Complete GERBER File
  • Quantities
  • Penalization Requirements
  • Materials Requirements
  • Finish requirements

 

Your custom quote will be delivered in just 2-24 hours, depending on the design complexity.

 

 

Main Export Markets:

  • Asia
  • Australasia

North America    

  • Western Europe

 

Factory overview

 

 

Fr4 Tg150 Cem1 LED Light Printed Circuit Board PCB with UL, ISO, SGS CertificatedFr4 Tg150 Cem1 LED Light Printed Circuit Board PCB with UL, ISO, SGS Certificated

FAQ

 

1. What kinds of boards can ABIS process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ABIS can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

5. How do ABIS ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 

ABIS cares every your order even 1 piece

 

 

 

 
 

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