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HDI High Density Interconnect PCB 36 layer S1000-2M Material

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36-layer 2-level HDI version semiconductor test board

Project	PCB process capability
Layer count	1-40 Layers
Min outer line width/space	3/3mil
Outer copper thickness	280um(8OZ)
Inner copper thickness	210um(6OZ)
Tolerance of PCB thickness	board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness＞1.0mm; ±10%
Minimum PTH	Mechanical hole 4mil, laser 3mil
Material	FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI	Levels 2-7
Special Process	Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;

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