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105um Copper 4mm Thickness Immersion Gold Fr4 Flex PCB

Shenzhen Shinelink Technology Ltd
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Address: Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131

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Shenzhen Shinelink Technology Ltd

105um Copper 4mm Thickness Immersion Gold Fr4 Flex PCB

Country/Region china
City & Province shenzhen guangdong
Categories Power Cables
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Product Details

Flexible Printed circuit Board 4mm Thickness Immersion Gold Fr4 Flex PCB

 

 

Layer: double-side board fpc
thickness: 0.13mm
min-hole: 0.25mm
surface:immersion gold

 

 

Flexible Printed Circuit Board (abbr. FPCB) .

 

FPCB is minimization, slimness, high technology for whole digital products which are getting smaller, slimmer.

Compare with the rigid printed circuit board , FPCB has the following advantages

 

1. Light, thin, short, small, flexible structure, can be bent, curled, folded, and three-dimensional assembly, adapter can replace a lot of parts, easy to use maximum available space, making electronic products become more slim in appearance, widely used has a small, lightweight and mobile requirements of all kinds of electronic products.

 

2. High heat resistance, can produce higher density and finer pitch products to meet the high density interconnect between the components and the high stability requirements, so that a larger increase the quality of the signal output.

 

3. Can be wound transfer roller processing methods (Roll-to-Roll), easily automated, mass production,improve production efficiency.

 

 

FPC Process Capability

 

ItemsFPC Process Capability
Number of LayersSingle Sided, Double Sided, Multilayer, Rigid-flex PCB
Based MaterialPI, PET
Copper Thickness9um,12um,18um,35um,70um,105um
Largest Board Area406mm X 610mm/16"X 24",The largest could be 7 meters length in Single sided Flexible Printed Circuit Board
Minimum Hole Diameter of Mechanical Drilling0.2mm/0.008"
Minimum Hole Diameter of Laser Drilling0.075mm/0.03"
Minimum Hole Diameter of Hole-punching0.50mm/0.02"
Tolerance of Plated Through Hole+/-0.05mm/±0.02"
Minimum Line Width0.075mm/0.003"
Minimum Line Spacing0.075mm/0.003"
Peel Strength1.2kg f/cm
Shape ProcessingDie Stamping, Cutting, Laser Prototyping
Appearance of Tolerance+/-0.05mm/ +/-0.02"
Solder Mask Type

PI Solder Mask Coverlay Film or PET Solder Mask Covelay Film Lamination

 

 

Multi-colored Liquid Photo-Imageable solder Mask Ink, Thermosetting Solder Mask Ink
Surface TreatmentPlating Tin, Immersion Tin, Plating Nickel Gold, ENIG (Electroless Nickel Immersion Gold),Immersion Nickel Gold, Chemical Nickel Gold,OSP (Organic Solderability Preservatives), Immersion Silver
 

 

 

Application For Whole Digital Products

 

 

 

Packing and Delivery

Packing

1. Firstly hermetic plastic bag fill with products,
2. Then bubble sheet separates them,
3. Finally paper carton packing.

Delivery

1. It would take 7-9 days to mufacture it after deposit received.Production time would depend on your drawing and process plan.

2. DHL,FedEx, UPS delivery. It is faster than vessel.Barely deliever it by vessel.

 

 

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